Corporate partnership produces next generation MEMS handler

02/22/2013

TESEC Corporation today announced the development and sales of the ULTRA MEMS handler, targeting Inertial (Accelerometer, Gyroscope and Magnetometer) MEMS devices. The ULTRA handler was designed jointly by TESEC and FocusTest, Inc. The ULTRA is a carrier based system with parallel test capabilities for 16, 32, 64 and 96 devices. The system will be available for demonstration and shipment mid-2013.

The overall MEMS market is the fastest growing portion of the semiconductor market, with 2012 revenues of $11.5B and an expected growth rate exceeding 10% for the next several years. According to TESEC’s Director of Sales, Keizo Yamaguchi, “the MEMS handling market is expanding rapidly and with the introduction of the ULTRA, TESEC intends to become a significant supplier to this segment.”

The ULTRA handler provides MEMS device suppliers with a significant throughput enhancement, as a significant portion of devices are being tested today on systems that provide only four to sixteen parallel processing. In addition to significantly higher parallel performance, the ULTRA offers a host of features aimed at higher performance and lower test time. With ±360 degree, 3 axis rotation the ULTRA is capable of providing stimulus for accelerometers and gyroscopes. A magnetic stimulus unit adds magnetometer test capability, making the ULTRA the industry’s first 9 degrees of freedom (DOF) capable system.

Future versions of the ULTRA are planned to expand coverage to address pressure sensor and high G MEMS devices.

“FocusTest brings 20 years of MEMS handling, stimulus and test experience to the ULTRA,” said Richard Chrusciel, ULTRA Product Development Manager, adding: “our partnership with TESEC brings over 40 years of experience and achievement in semiconductor handling, as well as a worldwide organization. The fusion of FocusTest and TESEC will bring world class automation to the MEMS handling market.”

The ULTRA handling and stimulus system is available in ambient and full tri-temperature configurations. Best of all, the unit is priced to avoid sticker shock, with base system configurations targeted to be of equal to or lower cost than current market products.

TESEC will provide world-wide sales/distribution, manufacturing and support for the ULTRA. FocusTest will provide MEMS and test cell specific engineering and applications.

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. 


VIDEOS

Electroiq 2 EIQ2

NEW PRODUCTS

Picosun’s 300mm ALD cluster tools selected for new memory applications

April 10, 2013 Picosun Oy, an Atomic Layer Deposition (ALD) equipment manufacturer, reports that its PICOPLATFORM 300 ALD cluster tool has bee...

Bruker introduces new AFM semiconductor characterization solution

April 4, 2013 Bruker announced today the release of the Dimension Icon SSRM-HR, a new atomic force microscope (AFM) configuration including t...

Ferrotec Temescal introduces electron beam metallization system

April 3, 2013 The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam met...

ProPlus Design Solutions launches SPICE simulator for giga-scale simulations

April 3, 2013 ProPlus Design Solutions, Inc. yesterday launched NanoSpice, the next-generation high-capacity, high-performance parallel SPICE...

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

WEBCASTS

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...

SUBSCRIBE

LATEST ISSUE

Volume 56, Issue 2

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS