World’s most complex 2d laser beamsteering array demonstrated

01/17/2013

Most people are familiar with the concept of RADAR. Radio frequency (RF) waves travel through the atmosphere, reflect off of a target, and return to the RADAR system to be processed. The amount of time it takes to return correlates to the object’s distance. In recent decades, this technology has been revolutionized by electronically scanned (phased) arrays (ESAs), which transmit the RF waves in a particular direction without mechanical movement. Each emitter varies its phase and amplitude to form a RADAR beam in a particular direction through constructive and destructive interference with other emitters.

Similar to RADAR, laser detection and ranging, or LADAR, scans a field of view to determine distance and other information, but it uses optical beams instead of RF waves. LADAR provides a more detailed level of information that can be used for applications such as rapid 3-D mapping. However, current optical beam steering methods needed for LADAR, most of which are based on simple mechanical rotation, are simply too bulky, slow or inaccurate to meet the full potential of LADAR.

As reported in the current issue of the journal Nature, DARPA researchers have recently demonstrated the most complex 2-D optical phased array ever. The array, which has dimensions of only 576µm x 576µm is composed of 4,096 (64 x 64) nanoantennas integrated onto a silicon chip. Key to this breakthrough was developing a design that is scalable to a large number of nanoantennas, developing new microfabrication techniques, and integrating the electronic and photonic components onto a single chip.

“Integrating all the components of an optical phased array into a miniature 2-D chip configuration may lead to new capabilities for sensing and imaging,” said Sanjay Raman, program manager for DARPA’s Diverse Accessible Heterogeneous Integration (DAHI) program. “By bringing such functionality to a chip-scale form factor, this array can generate high-resolution beam patterns — a capability that researchers have long tried to create with optical phased arrays. This chip is truly an enabling technology for a host of systems and may one day revolutionize LADAR in much the same way that ESAs revolutionized RADAR. Beyond LADAR, this chip may have applications for biomedical imaging, 3D holographic displays and ultra-high-data-rate communications.”

This work was supported by funding from DARPA’s Short-Range, Wide Field-of-View Extremely agile, Electronically Steered Photonic Emitter (SWEEPER) program under Josh Conway, and the Electronic-Photonic Heterogeneous Integration (E-PHI) thrust of the DAHI program. Future steps include integrating non-silicon laser elements with other photonic components and silicon-based control and processing electronics directly on-chip using E-PHI technologies currently under development.

Photo courtesy of MIT.

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. 


VIDEOS

Electroiq 2 EIQ2

NEW PRODUCTS

Picosun’s 300mm ALD cluster tools selected for new memory applications

April 10, 2013 Picosun Oy, an Atomic Layer Deposition (ALD) equipment manufacturer, reports that its PICOPLATFORM 300 ALD cluster tool has bee...

Bruker introduces new AFM semiconductor characterization solution

April 4, 2013 Bruker announced today the release of the Dimension Icon SSRM-HR, a new atomic force microscope (AFM) configuration including t...

Ferrotec Temescal introduces electron beam metallization system

April 3, 2013 The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam met...

ProPlus Design Solutions launches SPICE simulator for giga-scale simulations

April 3, 2013 ProPlus Design Solutions, Inc. yesterday launched NanoSpice, the next-generation high-capacity, high-performance parallel SPICE...

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

WEBCASTS

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...

Join The ConFab discussion

Tue Feb 26 11:27:00 CST 2013

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012

The ConFab: Big data is here

Sun Jun 03 19:19:00 CDT 2012

SUBSCRIBE

LATEST ISSUE

Volume 56, Issue 2

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS