Report: "Glaring imbalances" in printed electronics venture funding

January 17, 2013 - Printed, flexible, and organic electronics have garnered more than $7.5 billion in venture funding from 1996-2011, but funding has declined sharply from a peak in 2007, according to a report from Lux Research. Funding topped $990M in 2007, but lost a third of that value within four years to $626M in 2011.

"A number of high-profile failures like Konarka have soured many investors' impressions of this space -- cutting away some unwarranted hype, but potentially raising the hurdles for companies with more promising technologies to secure funds," stated Anthony Vicari, Lux Research associate and lead author of a new report examining investments and opportunities in printed, flexible, and organic electronics. He points to "glaring funding imbalances, with overfunding in areas such as organic photovoltaics, but promising technologies such as electrowetting and electrochromic displays haven't received investment that matches their potential."

Lux will present a Webinar on Feb. 5 to discuss the report's findings, but here's some insights in a nutshell:

- Display technologies have huge potential. Electrowetting, electrochromic, and metal oxide thin-film transistors (MOTFTs) are potential gold mines, offering high technical performance and value relative to competing reflective displays and TFTs.

- Asian startups are underfunded. North America leads overall investment at $5.1B, or 67% of the world total. However, Asian start-ups, like OLED developers in South Korea, account for just $506M of investing. That indicates not a lack of innovation, but the need for an alternate funding model, Lux says.

- Dow, Samsung, and Intel are trendsetters. These three giants lead corporate venture capital (CVC) investors, with high levels of activity in this space. Their best bets have targeted the more promising, higher-potential technologies such as OLEDs and RFID.

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.


VIDEOS

Electroiq 2 EIQ2

NEW PRODUCTS

Multitest announces ecoAmp for high-power applications

May 8, 2013 Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...

EV Group rolls out EVG120 processing system

May 7, 2013 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...

Quartz Imaging introduces automated measurement for semiconductor images

April 30, 2013

It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device.

Axcelis launches Purion XE high energy implanter

April 30, 2013 Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter...

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

WEBCASTS

Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

Join The ConFab discussion

Tue Feb 26 11:27:00 CST 2013

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012

The ConFab: Big data is here

Sun Jun 03 19:19:00 CDT 2012

SUBSCRIBE

LATEST ISSUE

05/01/2013
Volume 56, Issue 3

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS