New type of LED produced with simple, low cost process

Thomas Edison invented the first incandescent light bulb 130 years ago, which greatly contributed to the advancement of civilization. However, that technology is antiquated, economically inefficient to operate, and fragile.

Fluorescent lights are energy efficient but they are bulky and have to ‘warm-up’ when turned on. Their bulbs contain phosphorus and mercury, which are toxic to the environment. Today’s LED lights are also energy friendly but are expensive and difficult to manufacture. The process to make conventional LEDs is very complicated, as it involves the growth of single crystal layers on the single crystal substrate. Each layer has to contain low defects for it to work. The cost of LED lights is usually ten times the cost of the incandescent bulb, because the equipment to produce them is expensive, the raw materials are expensive, and the environmental and safety issues are critical. Another disadvantage of the current LEDs is they do not produce white light from a single chip. This requires extra manipulation, such as using a set of 3 chips emitting different lights or adding a phosphors material to the blue or UV chip to produce the white light. 

Professor Yue Kuo of the Artie McFerrin Department of Chemical Engineering at Texas A&M University has fabricated a new type of LED, capable of producing a wide spectrum light while operating for long periods of time at atmospheric conditions. This device is based on a new concept of light emission from an ultra-thin amorphous dielectric layer.     

Figure (left) Low- and (right) high-magnification photos of light emission from the new LED.

An article published in Applied Physics Letters, describes the light emission mechanism, characteristics of the emission spectrum, fabrication method, and the operation parameter effects on this type of LED. The device was fabricated with the room-temperature sputter deposition method on a silicon wafer. The light emission intensity could be enhanced with a nanocrystal layer embedded in the dielectric film. Most importantly, the complete process and materials are compatible with the existing IC fabrication facility.

“There is a need for a new type of LED that is: low cost, long operation life, small in size, emits white light, and easy to fabricate with environmentally friendly materials and process.” Dr. Kuo says. “ What makes this new LED unique is it meets all of these requirements plus it is extremely easy to fabricate with the existing equipment in all semiconductor fabs.” 

The light emitted is composed of small bright dots evenly distributed across the electrode surface.  The input voltage controls the intensity or brightness of the LED.  Dr. Kuo is very optimistic with the results of his findings. “We have discovered this phenomenon and studied this kind of LED for more than a year. It can be operated continuously for more than ten hours. A longer operation time is expected.”

Kuo‘s discovery has larger implications than just lighting. These LEDs could potentially be integrated into a computer processor; dramatically increasing the speed by transporting signals optically rather than by electrons through copper lines.  They could have use in various industries, entertainment, medical, commercial, and military areas due to the compact size and low cost. 

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

LIVE NEWS FEED


VIDEOS

Electroiq 2 EIQ2

NEW PRODUCTS

Multitest announces ecoAmp for high-power applications

May 8, 2013 Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...

EV Group rolls out EVG120 processing system

May 7, 2013 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...

Quartz Imaging introduces automated measurement for semiconductor images

April 30, 2013

It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device.

Axcelis launches Purion XE high energy implanter

April 30, 2013 Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter...

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

WEBCASTS

Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

SUBSCRIBE

LATEST ISSUE

05/01/2013
Volume 56, Issue 3

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS