KLA-Tencor announces new e-beam inspection system

01/30/2013

KLA-Tencor Corporation (NASDAQ: KLAC) announced the eS805, a new electron-beam inspection system capable of detecting very small defects, and defects that cause electrical problems such as opens, shorts or reliability issues. The eS805 is also designed to provide supplementary information to the fab's optical inspection systems, with the goal of boosting the ability of the optical inspectors to preferentially capture defects that matter.

Bobby Bell, executive vice president of KLA-Tencor's Wafer Inspection Group, said: "We believe that optical inspection will continue as the dominant defect inspection approach; its speed is essential for adequate wafer coverage, and our engineers have demonstrated some impressive ideas for stretching optical sensitivity to meet our customers' anticipated requirements. Electron-beam inspection will continue to complement optical inspection as needed..”

The high performance of the new eS805 is driven by the following advances:

  • New image computer, new auto-focus subsystem, and higher beam current densities than other commercially available systems, enabling detection of buried electrical defects in "voltage contrast" ("VC") mode over relatively large areas of the die;
  • Architecture designed to elicit significant signal from defects hidden at the bottom of high aspect ratio (HAR) structures such as FinFETs and 3D flash; and
  • Advanced algorithms that, together with the new image computer and auto-focus system, enable efficient capture of small defects within non-periodic structures, such as logic areas of the cell.

The eS805 is upgradeable from any previous eS3x or eS8xx-series e-beam inspection system.

New eS805 e-beam inspection systems have been shipped to leading logic and memory chip manufacturers, where they are being used to upgrade existing e-beam inspection capability or to fulfill requirements for additional inspection capacity in advanced development and production lines. To maintain high performance and productivity, the eS805 tools are backed by KLA-Tencor's global, comprehensive service network

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.


VIDEOS

Electroiq 2 EIQ2

NEW PRODUCTS

Picosun’s 300mm ALD cluster tools selected for new memory applications

April 10, 2013 Picosun Oy, an Atomic Layer Deposition (ALD) equipment manufacturer, reports that its PICOPLATFORM 300 ALD cluster tool has bee...

Bruker introduces new AFM semiconductor characterization solution

April 4, 2013 Bruker announced today the release of the Dimension Icon SSRM-HR, a new atomic force microscope (AFM) configuration including t...

Ferrotec Temescal introduces electron beam metallization system

April 3, 2013 The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam met...

ProPlus Design Solutions launches SPICE simulator for giga-scale simulations

April 3, 2013 ProPlus Design Solutions, Inc. yesterday launched NanoSpice, the next-generation high-capacity, high-performance parallel SPICE...

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

WEBCASTS

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...

SUBSCRIBE

LATEST ISSUE

Volume 56, Issue 2

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS