2013: Look for continued consolidation

01/02/2013

By Ron Leckie, President, Infrastructure Advisors

2012 brought a slowdown in consumer spending which has negatively impacted chip unit demand.  In fact, chip units have been essentially flat for much of the last two years.  However, the good news is that unlike in prior slow periods, average selling prices have maintained a steady level.  As a result, the industry sits today with slightly elevated inventories and also with factory utilization levels that are generally about 15 percentage points below normal healthy levels.  I look to enter 2013 with continued seasonal slowness, but anticipate that unit volumes and utilization levels will start picking up by the second quarter and throughout the year.

As a result, with utilization rates at the low end of the range, we will not be seeing any significant capacity additions until later in the year.  Capital purchases will be primarily for new technology capabilities until unit volumes pick up and in turn drive capacity needs.  The Test and Assembly equipment sectors should feel a recovery slightly ahead of their Wafer Fab counterparts since they tend to be more units-driven.

The semiconductor industry and its entire supply chain are certainly maturing and are becoming more dependent than ever on the overall economy.  Consumer influence is a big factor affecting semiconductor and electronics growth.  Individual companies either need to have new innovative products to gain market share and drive organic growth, or they need to acquire companies that will take them into new adjacent markets.

In recent years, we have seen consolidation by some of the larger companies in the industry.  However, when walking around trade shows such as Semicon West, it is evident just how many small and medium sized companies still exist.  For these companies to thrive in a mature market, they need critical mass and now is the time to be looking at strategic alternatives.  Such smaller companies with complementary product lines and customers should be looking for merger opportunities.  The semiconductor industry is truly global and for example, there are big synergies to be found when bringing together global sales and service operations.  Customers prefer working with strong suppliers who will be around to support them for years to come.

For the equipment and materials suppliers, their customer base is consolidating. Some of this is through M&A (Merger and Acquisition) activities and some is through the transition to heavily outsourced business models.  Instead of selling to many IDMs, they now find themselves dealing with customers who are mostly a few large IDMs, large Wafer Foundries and OSATs.

Increasingly, we find ourselves becoming more involved with clients who are seeking strategic alternatives to “business as normal.”  In 2013, it is anticipated that M&A transaction activities will increase and result in further consolidation of the semiconductor supply chain.  It’s true what they say – size does matter.

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.


VIDEOS

Electroiq 2 EIQ2

NEW PRODUCTS

Picosun’s 300mm ALD cluster tools selected for new memory applications

April 10, 2013 Picosun Oy, an Atomic Layer Deposition (ALD) equipment manufacturer, reports that its PICOPLATFORM 300 ALD cluster tool has bee...

Bruker introduces new AFM semiconductor characterization solution

April 4, 2013 Bruker announced today the release of the Dimension Icon SSRM-HR, a new atomic force microscope (AFM) configuration including t...

Ferrotec Temescal introduces electron beam metallization system

April 3, 2013 The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam met...

ProPlus Design Solutions launches SPICE simulator for giga-scale simulations

April 3, 2013 ProPlus Design Solutions, Inc. yesterday launched NanoSpice, the next-generation high-capacity, high-performance parallel SPICE...

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

WEBCASTS

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...

Join The ConFab discussion

Tue Feb 26 11:27:00 CST 2013

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012

The ConFab: Big data is here

Sun Jun 03 19:19:00 CDT 2012

SUBSCRIBE

LATEST ISSUE

Volume 56, Issue 2

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS