Singapore IME, MOSIS to offer silicon photonics wafer prototyping service

09/04/2012

September 4, 2012 - Singapore's Institute of Microelectronics (IME), a research institute of the Science and Engineering Research Council of the Agency for Science, Technology and Research (A*STAR), and MOSIS have signed a memorandum of understanding (MOU) to offer a multiple-project wafer (MPW) service targeting silicon integrated photonics.

The goal of the collaboration is to reduce the cost obstacles and promote broader adoption of silicon photonics devices for the industry. The partnership specifically involves sharing costs for the fabrication, the reticles or masks, the setup and use of the design environment. Photonics designers and researchers will also have access to IME's device library that includes integrated active and passive devices.

The two partners also are collaborating on multiproject runs for 3D through-silicon vias (TSV) and silicon interposers (TSI), and MEMS devices. These will be available at the end of 2012 and in 1H13, respectively.

"By leveraging the expertise and resources of one of the world's leading semiconductor research institutes, our partnership with IME will develop efficient and practical approaches in the area of silicon photonics to meet the increasing requirements of industry," stated Wes Hansford, director of MOSIS.

"We look forward to offering our MPW capabilities to the silicon photonics community to enable innovations and product development to accelerate the growth of the silicon photonics industry," added Prof. Dim-Lee Kwong, executive director of IME.


Visit the Semiconductors Channel of Solid State Technology, and sign up for our WaferNEWS e-newsletter!

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. 


VIDEOS

Electroiq 2 EIQ2

TECHNOLOGY PAPERS

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

Faster Time to Root Cause with Diagnosis-Driven Yield Analysis

This whitepaper describes the benefits of implementing a diagnosis-driven yield analysis flow using the Tessent® Diagnosis and Tessent YieldInsight® software...

WEBCASTS

Innovation in Semiconductor Manufacturing Instrumentation

As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...

3D and 2.5D Integration: A Status Report Live Event

This webcast will explore the present status of 2.5 and 3D integration, including TSV formation.

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012

The ConFab: Big data is here

Sun Jun 03 19:19:00 CDT 2012

Oh, snap!: Pics from The ConFab

Sun Jun 03 19:09:00 CDT 2012

SUBSCRIBE

LATEST ISSUE

Volume 56, Issue 1

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS