Everspin to unveil highest-density ST-MRAM

09/20/2012

While conventional charge-based memory is approaching fundamental scaling limits, several so-called “emerging memories” have migrated from laboratory samples to integrated products. Among various emerging memory technologies, MRAM (magnetoresistive random access memory) has been making impressive progress, ahead of other emerging memories, and has demonstrated the capability to be a successor to DRAM or SRAM. MRAM data is stored via magnetic moments. Parallel or anti-parallel magnetic moments in MRAM stacks present the “0” or “1” state. In earlier generations of MRAM, these states were switched by current-induced magnetic field but that is an obstacle for scaling.

The invention of ST (spin-torque) MRAM, which is switched by injecting spin-polarized tunneling current, removes the scaling limitation. In an invited paper at the International Electron Devices Meeting, researchers from Everspin Technologies will describe how they built the largest functional ST-MRAM circuit ever built, a 64-Mb device with good electrical characteristics. The work shows that MRAM technology is fast approaching commercialization.

Everspin MRAM products employ a one transistor, one magnetic tunnel junction (MTJ) memory cell for the storage element. The MTJ is composed of a fixed magnetic layer, a thin dielectric tunnel barrier and a free magnetic layer. When a bias is applied to the MTJ, electrons that are spin polarized by the magnetic layers traverse the dielectric barrier through a process known as tunneling. The MTJ device has a low resistance when the magnetic moment of the free layer is parallel to the fixed layer and a high resistance when the free layer moment is oriented anti-parallel to the fixed layer moment.

ST-MRAM uses an alternate method for programming an MTJ element that has the potential to further simplify the MRAM cell and reduce write power. Programming is accomplished by driving current directly through the MTJ to change the direction of polarization. The read operation is accomplished by sensing the MTJ resistance, just like Toggle MRAM.

Everpsin says that ST-MRAM products will offer a new storage class memory solution for non-volatile buffers and caching applications as well as deliver a new nanosecond-class, gigabyte-per-second non-volatile storage tier. Using a spin-polarized current for switching, ST-MRAM can overcome scaling limitations to address persistent DRAM applications in densities from megabits to gigabits.

 

The device has a wide separation between applied and breakdown voltages— the more separation, the wider the device operation margin.

 

This “shmoo plot,” is a graphical display of the ST-MRAM’s performance over a range of voltages. The green area signifies there were no failures of the memory as voltages increased, indicating that its design is robust.

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. 


VIDEOS

Electroiq 2 EIQ2

TECHNOLOGY PAPERS

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

Faster Time to Root Cause with Diagnosis-Driven Yield Analysis

This whitepaper describes the benefits of implementing a diagnosis-driven yield analysis flow using the Tessent® Diagnosis and Tessent YieldInsight® software...

WEBCASTS

Innovation in Semiconductor Manufacturing Instrumentation

As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...

3D and 2.5D Integration: A Status Report Live Event

This webcast will explore the present status of 2.5 and 3D integration, including TSV formation.

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012

The ConFab: Big data is here

Sun Jun 03 19:19:00 CDT 2012

Oh, snap!: Pics from The ConFab

Sun Jun 03 19:09:00 CDT 2012

SUBSCRIBE

LATEST ISSUE

Volume 56, Issue 1

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS