Canon U.S.A., Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors. The FPA-3030 platform is an upgrade to earlier Canon “FPA-3000 platform” steppers. The FPA-3030i5+ features an overhauled software structure and electrical control system that allow application of optional advanced hardware (e.g., projection lens, wafer stage, and alignment system) that is not compatible with traditional FPA-3000 platform steppers.
The FPA-3030i5+ is capable of providing imaging resolution below 0.35mm, while maintaining overlay accuracy of less than or equal to 40nm and throughput equal to or in excess of 104 wafers per hour.
The FPA-3030 platform allows the use of optional equipment designed for the processing of silicon (Si), sapphire (Al2O3), silicon carbide (SiC) and a wide variety of wafer materials used in environmentally conscious device manufacturing. Optional equipment for the FPA-3030i5+ includes warped-wafer handling systems to allow processing of distorted substrates, and advanced image processing systems for clear substrates.
With the purchase of the optional Multi-Size Wafer Kit, the FPA-3030i5+ stepper can also be configured to process multiple wafer sizes, and can be equipped with other optional equipment to help improve productivity and efficiency.
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