LED researchers in China order AIXTRON MOCVD tool

August 17, 2012 -- Jilin University China has installed an AIXTRON CCS MOCVD 3 x 2” wafer configuration system for gallium nitride (GaN) ultraviolet (UV) and white light-emitting diode (LED) research.

Researchers in Taiwan recently installed an AIXTRON MOCVD system for work on GaN power semiconductors.

Jilin University China is an existing customer for AIXTRON. Dr. Zhang of the Jilin University, State Key Laboratory on Integrated Optoelectronics, commented that the researchers were “particularly impressed with the reactor’s ergonomics and security.” One of AIXTRON’s local support teams has installed and commissioned the new reactor in a state-of-the-art clean-room facility at Jilin University in Changchun, China.

“Our intention is to develop exciting new material structures that will lead to greater understanding and to production of gallium nitride materials for UV and white LEDs. This is a challenging task, but we are confident that the combination of the process technology capabilities of the CCS reactor and strong backing from the local AIXTRON support team will enable us to achieve our aims quickly and efficiently,” added Zhang.

Using the Close Coupled Showerhead (CCS) technology, reagents are introduced into the reactor through a water-cooled showerhead surface over the entire area of deposition. The showerhead is close to the substrates and is constructed to enable precursors to be separated right up to the point where they are injected onto the substrates through a multiplicity of small tubes. The reagents are injected into the reactor chamber through separate orifices in a water-cooled showerhead injector, to create a very uniform distribution of reagent gases.

Substrates are placed on top of a rotating susceptor, which is resistively heated. The three-zone heater enables modification of the temperature profile to provide temperature uniformity over the susceptor diameter.

Jilin University is a leading national university under the direct jurisdiction of China's Ministry of Education, located in Changchun, the capital city of Jilin Province in Northeast China. The University boasts sixteen disciplinary areas, six state key laboratories, and eight national bases for the development of basic science. Other resources include seven key laboratories sponsored by the Ministry of Education and eleven by other ministries of the Chinese government.

AIXTRON provides MOCVD production technologies for semiconductor devices, such as LEDs, lasers, transistors and solar cells. For further information on AIXTRON (FSE: AIXA, ISIN DE000A0WMPJ6, DE000A1MMEF7; NASDAQ: AIXG, ISIN US0096061041), see www.aixtron.com.

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.


VIDEOS

Electroiq 2 EIQ2

NEW PRODUCTS

Spectra-Physics introduces industrial picosecond laser

May 10, 2013 Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...

Multitest announces ecoAmp for high-power applications

May 8, 2013 Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...

EV Group rolls out EVG120 processing system

May 7, 2013 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...

Quartz Imaging introduces automated measurement for semiconductor images

April 30, 2013

It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device.


TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

WEBCASTS

Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

Join The ConFab discussion

Tue Feb 26 11:27:00 CST 2013

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012

The ConFab: Big data is here

Sun Jun 03 19:19:00 CDT 2012

SUBSCRIBE

LATEST ISSUE

05/01/2013
Volume 56, Issue 3

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS