July 19, 2012 -- Osram Opto Semiconductors developed a concept for uniform solder pads based on the Oslon light-emitting diode (LED) component family. This enables second sourcing by Osram’s LED customers without an additional soldering board, potentially reduces the costs of storage and process modification.
LED components from different manufacturers can differ in the dimensions and shape of their solder pads. For second sourcing, two different soldering boards are made, to suit the LEDs from two different manufacturers.
The combined board design comes from the design of one of the two LED components. The individual solder surfaces are divided into segments, electrically connected and electrically disconnected. By selecting appropriate spacings between the solder surfaces, makers can attach the second LED product -- rotated 90° -- to the uniform board design. The anode and cathode of the two LED components are connected to the same electrically contacted segments. Because solder surfaces are divided, the two LED types automatically align themselves to the edges of the solder surfaces during the reflow solder process.
Osram Opto Semiconductors has developed a concept for ceramic LED components, such as the Oslon family, that makes the board solder pad design so adaptable that it can be used for LED components from at least two different manufacturers. The concept can also be used for metal core, FR4, and ceramic boards.
For both LED components, the luminous area is in the same lateral position on the board. If the LEDs have the same emission behavior, the same secondary lenses and reflectors can be used. This means that neither the LED components nor the end application are changed in terms of their characteristics.
OSRAM AG, a wholly owned subsidiary of Siemens, is a leading lighting manufacturer. Its subsidiary, OSRAM Opto Semiconductors GmbH, offers semiconductor-based technology for lighting, sensor and visualization applications. For more information, go to www.osram-os.com.