LED insights from SEMICON West 2012

07/11/2012

July 11, 2012 -- Citi analysts surveyed the light-emitting diode (LED) manufacturing market and LED demand at SEMICON West 2012, taking place this week at the Moscone Center in San Francisco, CA.

Demand for general lighting applications remains robust for LEDs, though the LED oversupply remains significant. This could explain why orders for metal organic chemical vapor deposition (MOCVD) tools have ticked slightly higher, but primarily limited to Epistar and some small China orders.

From a chip perspective, discussions suggest Cree (NASDAQ:CREE) stepped on some large customers toes when it acquired Ruud Lighting in August 2011. Ruud makes outdoor lighting fixtures based on LEDs. This has had greater than expected negative impact on chip demand, Citi says. The downstream acquisition for the LED maker is viewed by some customers as directly competitive with their businesses.

View Citi's full report at http://ir.citi.com/uyRtd8u%2B6M2pDF7aCZQyUr4RBK2BMqjLd6ziy8f56t2Ci20uJjgV%2Bg%3D%3D

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. 


VIDEOS

Electroiq 2 EIQ2

TECHNOLOGY PAPERS

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

Faster Time to Root Cause with Diagnosis-Driven Yield Analysis

This whitepaper describes the benefits of implementing a diagnosis-driven yield analysis flow using the Tessent® Diagnosis and Tessent YieldInsight® software...

WEBCASTS

Innovation in Semiconductor Manufacturing Instrumentation

As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...

3D and 2.5D Integration: A Status Report Live Event

This webcast will explore the present status of 2.5 and 3D integration, including TSV formation.

SUBSCRIBE

LATEST ISSUE

Volume 56, Issue 1

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS