July 11, 2012 -- ATMI Inc. (NASDAQ-GS: ATMI) entered into a joint development agreement (JDA) with IBM to address critical wet process challenges at the 14nm semiconductor node and smaller.
The companies will develop and commercialize advanced chemical formulations for front end of line (FEOL) and back end of line (BEOL) cleans applications over a two-year period.
ATMI and IBM have worked together on various semiconductor manufacturing challenges, said Tod Higinbotham, ATMI EVP and GM, Microelectronics, who noted that collaboration model has become “critically important” to suppliers and their key customers.
IBM also recently partnered with TEL NEXX to develop 3D semiconductor packaging technologies.
ATMI Inc. provides specialty semiconductor materials, and safe, high-purity materials handling and delivery solutions designed to increase process efficiencies for the worldwide semiconductor, flat panel, and life sciences industries. For more information, please visit http://www.atmi.com.
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