June 3, 2012 -- Cymer presented at Barclays Capital’s BarCap 2012 Global TMT Conference, providing information on semiconductor makers’ transition from deep ultra violet (DUV) to extreme ultraviolet (EUV) lithography, pre-pulse technology demonstrations, and more.
DUV pulse utilization has been strengthening following a seasonal low in January. This in turn is driving ion beam proximity (IBP) demand. Cymer is using strength in DUV and IBP to invest in EUV lithography development and commercialization.
Higher throughput is supporting transition from DUV to EUV, Cymer reported. Cymer highlighted that it recently demonstrated 50W raw power at high duty cycle with good dose stability by evoking pre-pulse technology, strengthening faith in EUV technology and spurring R&D spending. Cymer now has 9 of its 3100 EUV sources installed and operational -- 5 at key chipmakers, 1 at ASML, and 3 at Cymer for performance improvement and development.
Cymer expects final qualification for a 20W light source to be completed in H1, with deployment this summer. The 50W (25 wafers/hr) light source is currently being qualified and should be completed by the end of Q3 with deployment at the end of the year. Cymer expects to begin qualification on a 100W light source at a high duty cycle at the beginning of 2013.
Cymer also noted that it is supporting advanced display manufacturing, through its TCZ Group.
Cymer (Nasdaq:CYMI) supplies light sources used by chipmakers to create advanced semiconductor chips. Learn more about Cymer at www.cymer.com.