Touchscreen tech company Neonode to list as NEON on NASDAQ

April 27, 2012 - BUSINESS WIRE -- Multi-sensing touchscreen technology developer Neonode Inc. (OTC BB:NEON) was approved by The NASDAQ Stock Market LLC to begin listing its common stock on the NASDAQ Capital Market under the ticker symbol NEON, on May 1.

The NASDAQ listing will give “increased visibility” to Neonode, said its CEO Thomas Eriksson. The company’s zForce touch technology supports “multisensing,” will capabilities such as proximity-, pressure- and depth sensing, as well as object-size measuring. The technology suits devices like smartphones, tablets, toys and gaming consoles, printers and office equipment, e-readers and automotive or inflight infotainment systems.

Also read: Neonode enters consumer display sector with new licensing agreement and Neonode optical touch technology replaces resistive touch on office equipment line

Neonode's customers include Sony, Barnes & Noble, Oregon Scientific, L&I, Daesung and Sonim.

Neonode Inc. (NEON) develops and licenses the next generation of proven optical MultiSensing technologies. For further information please visit www.neonode.com.

Visit our new Displays Manufacturing Channel on Solid State Technology and subscribe to our Displays Digest e-newsletter!

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.


VIDEOS

Electroiq 2 EIQ2

NEW PRODUCTS

Multitest announces ecoAmp for high-power applications

May 8, 2013 Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...

EV Group rolls out EVG120 processing system

May 7, 2013 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...

Quartz Imaging introduces automated measurement for semiconductor images

April 30, 2013

It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device.

Axcelis launches Purion XE high energy implanter

April 30, 2013 Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter...

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

WEBCASTS

Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

SUBSCRIBE

LATEST ISSUE

05/01/2013
Volume 56, Issue 3

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS