LED manufacturer Lumichip expands in Finland, opens development center

Lumichips Espoo, Finland expansion.

April 27, 2012 -- Lumichip Limited, a light-emitting diode (LED) manufacturer, expanded its commercial operations in Finland and opened a new development center in Espoo, Finland. The new development and customer service center are at the Micronova Building, Otaniemi campus, part of the Finnish high technology development cluster in Espoo, where global technology companies and research institutions such as VTT and Aalto University operate.

“Lumichip has an increasing client base in Europe and Scandinavia,” noted Dr. Juha Rantala, chairman of the Lumichip group. Lumichip’s new global commercial service center will support all technical aspects and product sales for LED customers.

The company’s investments in Finland also include research, from basic LED component to advanced light engine technology design, and production of custom-designed LED light systems. “Our chip and package design and manufacturing will continue in Asia, but we wish to leverage the leading edge electronics and systems development expertise available in Finland into our new products and services,” Dr Rantala said.

Lumichip’s new European Micronova site is within the Finland National Research Infrastructure for micro- and nanotechnology and its modern facilities include 2600m2 of cleanrooms and processing lines for silicon CMOS, MEMS, III-V optoelectronics and various thin film devices. The available technologies and expertise of the center will be part of Lumichip’s technology roadmap for better LED devices and systems with intelligence, reliability and cost efficiency.

Learn more at www.lumichip.com.

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.


VIDEOS

Electroiq 2 EIQ2

NEW PRODUCTS

EV Group rolls out EVG120 processing system

May 7, 2013 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...

Quartz Imaging introduces automated measurement for semiconductor images

April 30, 2013

It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device.

Axcelis launches Purion XE high energy implanter

April 30, 2013 Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter...

EMS debuts low-cost conductive LED die attach adhesive

April 29, 2013 Engineered Material Systems debuted its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small s...

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

WEBCASTS

Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

SUBSCRIBE

LATEST ISSUE

05/01/2013
Volume 56, Issue 3

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS