March 30, 2012 -- Qualcomm Incorporated (NASDAQ:QCOM) will establish an integrated circuit (IC) design and engineering R&D center in Singapore. The operation will work on analog, power, mixed-signal, and digital chip design and development, as well as mask layouts and pre- and post-silicon verification.
Local Singapore and regional talent will work at the IC Design and Engineering R&D center, developing hardware and software design support.
Qualcomm CDMA Technologies, the company's chipset division, will also manage certain strategic business planning and development, sourcing, procurement and distribution, and marketing and administrative functions from Singapore. It will augment its existing product test center in Singapore as part of the initiative.
Singapore's Minister of State for Trade and Industry, Teo Ser Luck, called Qualcomm's Singapore expansion "a significant addition to our electronics/semiconductor ecosystem." Applied Materials (AMAT) recently established a chip packaging R&D center in Singapore, collaborating with A*STAR.
Qualcomm first set up its chipset distribution center in Singapore in 2000. In 2008, Qualcomm established its first test development center outside of the United States in Singapore, enabling Singapore to become Qualcomm’s development hub for the Asia Pacific region.
Qualcomm Incorporated (NASDAQ: QCOM) is the world leader in 3G and next-generation mobile technologies. Learn more at http://www.qualcomm.com.
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