Progress in Printed Electronics: An Interview with PARC’s Janos Veres

PARC, a Xerox Company, is a pioneer in the development and commercialization of thin film transistors, circuits, and sensors. With a 40 year history of commercial innovation, PARC scientists have a deep knowledge of printing technology applied in domains such as displays, image sensors, and medical sensors, PARC's technical expertise and facility support printed dielectrics, nanoparticle metals, organic, oxide, and silicon (amorphous, polycrystalline, printed nanowire) semiconductors.

Solid State Technology editor Pete Singer caught up with Janos Veres, area manager for printed electronics in the electronic materials and devices laboratory at PARC. Veres’ current interests are in combining disruptive material, process, and device technologies -- for printed, flexible circuits; sensor and memory arrays; batteries and display devices -- all with a focus on early commercialization opportunities. Janos has experience in components such as novel printed circuits, organic transistors, and printable semiconductors; applications such as OLEDs, displays, and RFID; as well as printing/coating technologies including electrophotography, flexography, and offset printing.

Before joining PARC, Veres was the CTO at PolyPhotonix, where he developed radically new process technologies for OLED devices. Prior to that, he worked at Eastman Kodak as their Program Manager of Printed Electronics, and was a Business Research Associate at Merck Chemicals (formerly Avecia) where he led several of the world's first demonstrators built using novel electronic materials. Janos also set up unique pilot production lines for solution coating when he was responsible for Organic Photoreceptor development at Gestetner Byfleet. Dr. Veres holds a Ph.D. in Solid State Electronics from Imperial College in London and an MSc in Physical Electronics with distinction from Lviv Technical University in Ukraine.

Veres said described printed electronics as a relatively new field, with the “early years” being only 10-12 years ago. The focus is on materials that can be formulated as inks and deposited over large areas. This is quite useful for applications such as flexible displays, which was the original focus of the work, and more recently on smart cards and printed tags.  Recent progress has printed electronic transistors inching closer to those produced in polysilicon.

“We never believed that they might one day compete with amorphous silicon,” Veres notes. “That’s happened and probably 4-5 years ago, we saw that barrier broken. That means we can now take organic materials and achieve the same kind of performance that you see in displays. That progress is carrying on and at the lab level, you can build devices that are now performing better than what amorphous silicon offers. The progress will not stop there. We might see a significant improvement in mobilities at which point devices we build might be competing with polysilicon.”

This kind of progress could disrupt conventional microelectronics manufacturing. “A factory might look very different than the conventional microelectronics factory. It might look more like a printing press than a microelectronics fab,” Veres said.

Listen to the podcast interview with Veres below:

 

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.


VIDEOS

Electroiq 2 EIQ2

NEW PRODUCTS

EV Group rolls out EVG120 processing system

May 7, 2013 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...

Quartz Imaging introduces automated measurement for semiconductor images

April 30, 2013

It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device.

Axcelis launches Purion XE high energy implanter

April 30, 2013 Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter...

EMS debuts low-cost conductive LED die attach adhesive

April 29, 2013 Engineered Material Systems debuted its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small s...

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

WEBCASTS

Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

Join The ConFab discussion

Tue Feb 26 11:27:00 CST 2013

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012

The ConFab: Big data is here

Sun Jun 03 19:19:00 CDT 2012

SUBSCRIBE

LATEST ISSUE

05/01/2013
Volume 56, Issue 3

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS