President Obama's Intel visit: Fab 42 update, American manufacturing themes

January 27, 2012 -- President Barack Obama visited the Intel Ocotillo campus in Chandler, AZ on January 25, as part of a US tour following his State of the Union address. President Obama's visit in 2011 (Oregon) was the stage for Intel to announce Fab 42 in Arizona, with a $5 billion investment. The President spoke about Intel's technological innovation, and manufacturing jobs in America.

When complete, Intel’s Fab 42 will be the most advanced high-volume semiconductor manufacturing facility in the world, Intel asserts. Intel is nearing completion of, and will soon be equipping and ramping production at, three new wafer fabs, with Hillsboro, OR and Ireland joining Chandler. The company plans to begin 14nm production in Chandler when that fab opens in 2013. President Obama noted the world’s largest land-based crane, being used in Fab 42 construction, which is capable of pulling up to 4,000 tons.


Photo. President Barack Obama delivering remarks at Intel’s Fab 42 construction site Jan. 25, 2012.



Obama also acknowledged Intel president and CEO Paul Otellini, who serves on the president's Jobs Council. "I’m here because the factory that’s being built behind me is an example of an America that is within our reach.  An America that attracts the next generation of good manufacturing jobs.  An America where we build stuff and make stuff and sell stuff all over the world," Obama said in a speech at the location.


Photo. Intel Fab 42 Construction Manager Preston McDaniel welcoming President Barack Obama to Intel’s Fab 42 construction site Jan. 25, 2012.



Fab 42 is employing "thousands of construction workers who will put in more than 10 million hours on the job. When this factory is finished, Intel will employ around 1,000 men and women, making the computer chips that power everything from your smart phone to your laptop to your car," the President noted. He added that Intel invests in start-ups and in education of young engineers, stating, "We can use more engineers all across America." (The full transcript is available via the White House website http://www.whitehouse.gov/the-press-office/2012/01/25/remarks-president-intel-ocotillo-campus-chandler-az)


Figure. Artist's rendering of the $5 billion new chip manufacturing facility and support buildings to be built at Intel's site in Chandler, Ariz. The new factory, designated Fab 42, will be the most advanced, high-volume semiconductor manufacturing facility in the world. Construction is underway and is expected to be completed in 2013.

Also read: Intel, Samsung, TSMC semiconductor capex in 2012

Subscribe to Solid State Technology

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.


VIDEOS

Electroiq 2 EIQ2

NEW PRODUCTS

Spectra-Physics introduces industrial picosecond laser

May 10, 2013 Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...

Multitest announces ecoAmp for high-power applications

May 8, 2013 Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...

EV Group rolls out EVG120 processing system

May 7, 2013 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...

Quartz Imaging introduces automated measurement for semiconductor images

April 30, 2013

It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device.


TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

WEBCASTS

Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

Join The ConFab discussion

Tue Feb 26 11:27:00 CST 2013

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012

The ConFab: Big data is here

Sun Jun 03 19:19:00 CDT 2012

SUBSCRIBE

LATEST ISSUE

05/01/2013
Volume 56, Issue 3

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS