New installed wafer capacity leader: Taiwan took over in 2011

January 16, 2012 -- Taiwan became the region with the largest share of installed wafer capacity in 2011, according to IC Insights' Global Wafer Capacity 2011-12 report. This is the first time Taiwan has led the global wafer capacity rankings, with 21% of total in mid-2011.

Each regional number is the total installed monthly capacity of semiconductor fabs in that region, regardless of the headquarters location for the companies that own the fabs.

Top 5 regions, installed wafer processing capacity:

  1. Taiwan: 21%
  2. Japan: 19.7%
  3. Korea: 16.8%
  4. The Americas: 14.7%
  5. China: 8.9%

Figure. Installed wafer fab capacity (K w/m) in global regions (based on where the capacity is installed, not where the parent company is headquartered), July 2011.

Note: Rest of world (ROW) is primarily Singapore, Israel, Malaysia, also including Russia, Belarus, India, South Africa, and Australia.


Taiwan is not only the largest wafer processing region, but it also has the largest share of 300mm capacity.  In 2011, Taiwan held 25.4% share of worldwide 300mm wafer capacity, 18.7% of 200mm wafer capacity, and 11.4% of 150mm wafer capacity. 300mm wafers represent 64.6% of the country's installed capacity; 200mm wafers are 29.2%; 150mm wafers accounted for 6.1%.

Taiwan also leads the industry with capacity dedicated to "not so leading-edge" 40nm-60nm process geometries. Taiwan focuses on providing foundry services to various fabless IC suppliers, fab-lite IDMs, and electronic system producers.

Taiwan re-elected its leader Ma Ying-jeou of the Kuomintang (KMT) for a second term this week. Ma is not expected to make any major economic and regulatory reforms, according to the US-Taiwan Business Council.

IC Insights also notes in the research that China accounts for more wafer capacity than all of Europe. Nearly all of the installed wafer fab capacity (80%+) is in the top 5 regions.

Also read: Semiconductor fab capex forecast for 2012

Detailed analysis and a forecast of the IC industry's wafer fab capacity through 2016 is provided in the 2011-12 edition of IC Insights' Global Wafer Capacity report.

Published in November 2011, the Global Wafer Capacity 2011-2012 report features IC wafer capacity analyses and forecasts through 2016. View http://www.icinsights.com/services/global-wafer-capacity/ for more information. IC Insights Inc. provides high-quality, cost-effective market research for the semiconductor industry.

Subscribe to Solid State Technology

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.


VIDEOS

Electroiq 2 EIQ2

NEW PRODUCTS

Multitest announces ecoAmp for high-power applications

May 8, 2013 Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...

EV Group rolls out EVG120 processing system

May 7, 2013 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...

Quartz Imaging introduces automated measurement for semiconductor images

April 30, 2013

It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device.

Axcelis launches Purion XE high energy implanter

April 30, 2013 Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter...

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

WEBCASTS

Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

Join The ConFab discussion

Tue Feb 26 11:27:00 CST 2013

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012

The ConFab: Big data is here

Sun Jun 03 19:19:00 CDT 2012

SUBSCRIBE

LATEST ISSUE

05/01/2013
Volume 56, Issue 3

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS