|
Semiconductors
|
Displays
|
LEDs
|
MEMS
|
Packaging
|
Top Story Right
|
Energy Storage
|
Laser Micromachining
|
Editors Picks
|
Lasers and Sources
|
Photonics Business
LEDs 2012 P
-
03/08/2012 -- China-based LED maker orders 3 AIXTRON MOCVD tools
AIXTRON received a new MOCVD systems order from existing customer Quantum Wafer Inc., China. The 3 additional MOCVD units will process HB-LED wafers based on GaN materials. -
03/07/2012 -- LED makers could diversify with GaN power electronics production
The gallium nitride (GaN) power elec market is currently small, but new entrants are ramping to production, silicon-based electronics suppliers developing GaN, and LED makers diversifying capacity to make power semis. -
03/06/2012 -- Automated film frame handlers increase LED and semiconductor production
Owens Design Inc. released multiple customized film frame automated handlers to customers in the semiconductor and LED manufacturing tool industries. -
03/02/2012 -- HB-LED grade aluminum nitride (AlN) sintering
Part 2 of this series covers furnace considerations for a new HB-LED-grade AlN, as well as furnace throughput. Jonathan Harris, CMC Laboratories, covers the role of the oxide sintering phase in AlN in defining the materials microstructure and thus determining key properties such as thermal conductivity and mechanical strength. -
02/29/2012 -- Spectroradiometer measures LED phosphors
Gamma Scientific developed the Bi-Spectral Fluorescence Spectroradiometer to quickly obtain detailed fluorescence data for LED phosphors and other fluorescent or reflective materials. -
02/27/2012 -- UL authorized for LED testing to Zhaga standards
UL has been named a Zhaga-authorized LED testing center. Zhaga standards cover the physical dimensions, as well as the photometric, electrical and thermal behavior of LED light engines. -
02/24/2012 -- UV-LEDs fabricated with solution process, oxide-in-oxide design
A team of scientists at Los Alamos National Laboratory has developed a process for creating glass-based, inorganic LEDs that produce light in the UV range. -
02/23/2012 -- Present at coolingZONE LED 2012 in Berlin
coolingZONE LED, May 29-31 in Berlin, is soliciting technical presentations on LED energy consumption, LED packaging, heat and air-flow simulations of LED products, and related topics. -
02/20/2012 -- Verticle takes hexagonal LED chips to mass production
Verticle began mass production of its hexagonal-shaped LED chip Honeycomb, developed with a proprietary copper substrate and chemical chip separation technology. -
02/20/2012 -- Present at Strategies in Light Europe
Strategies in Light Europe, September in Munich, is accepting presentation abstracts through February 29. Submit a paper on LED technology, LED manufacturing and the supply chain, markets, LED applications, or a related topic.
POST A COMMENT
Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.
EDITORS' PICKS
TOP BLOG POSTS
Intel Foundries MEMS for Fuel Cell Start-up Nectar
IFTLE 134 SEMI 3D European Summit – Is the Wide IO Driver Dead?
EUV source roadmaps: Physics vs Engineering
Intel details 22nm trigate SoC process at IEDM
IFTLE 128: RTI 3D ASIP Part 1; Lester the Lightbulb update
Questions and answers on FD-SOI
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
LIVE NEWS FEED
RECENT ARTICLES
SEMICONDUCTOR ARTICLES
PACKAGING ARTICLES
MEMS ARTICLES
VIDEOS
NEW PRODUCTS
|
COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
|
|
Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...
|
|
Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
|
|
EV Group rolls out EVG120 processing system
May 7, 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...
|
TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...
|
Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
|
WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
|
450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
|
BUYERS GUIDE
BLOGS
Join The ConFab discussion
02/26/2013
Questions and answers on FD-SOI
01/04/2013
Present your ideas at The ConFab in 2013
11/26/2012
The ConFab 2013 countdown begins
08/09/2012
The ConFab: Big data is here
06/03/2012
IBM surprises with 22nm details at IEDM
12/12/2012
SUBSCRIBE
LATEST ISSUE
05/01/2013
Volume 56, Issue 3
Article Archive for Solid State Technology.