|
Semiconductors
|
Displays
|
LEDs
|
MEMS
|
Packaging
|
Top Story Right
|
Energy Storage
|
Laser Micromachining
|
Editors Picks
|
Lasers and Sources
|
Photonics Business
LEDs 2012 P
-
Wed Dec 12 04:00:00 CST 2012 -- Why Taiwan LED equipment vendors can't support a 2013 rebound
Taiwan makers of light-emitting diode (LED) products are unlikely to support a recovery in 2013 LED equipment spending due to an alarming cash crunch individually and sector-wide, warns one industry analyst. -
Thu Dec 06 06:00:00 CST 2012 -- KLA-Tencor's updated LED wafer inspection tool boosts throughput, efficiency
KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers. -
Mon Oct 15 12:49:00 CDT 2012 -- Measuring inside an active OLED
Researchers at the National Institute of Advanced Industrial Science say they have devised a way to selectively and nondestructively evaluate molecules within a sealed organic light-emitting diode (OLED) in operation, in hopes to further understand and eventually minimize performance degradation. -
Wed Oct 10 09:09:00 CDT 2012 -- Azzurro, Epistar achieve GaN-on-Si on 150mm
Azzurro and Epistar say they have achieved GaN-on-Si based high-brightness LEDs on 150mm GaN-on-Si substrates, billed as "one step further towards implementation in mass production." -
Mon Oct 08 09:00:00 CDT 2012 -- Solvay unveils high-performance polyester material for LED TV components
Solvay Specialty Polymers USA LLC has extended its line of high-performance polyester compounds with a new version targeting light-emitting diode (LED) TVs with higher heat and light stability. -
Fri Oct 05 12:33:00 CDT 2012 -- ON Semiconductor joins imec’s GaN-on-Si research program
ON Semiconductor has joined imec to collaborate on the development of next-generation GaN-on-Si power devices. ON Semiconductor is presently building a GaN processing line in its Oudenaarde facility in Belgium Oudenaarde, and it is expected to employ GaN-on-Si technology. -
Thu Aug 30 20:04:00 CDT 2012 -- Cree intros 150mm 4HN SiC epi wafers
Cree announced the availability of high quality, low micropipe 150mm 4H n-type silicon carbide (SiC) epitaxial wafers. 150mm epitaxial wafers with highly uniform epitaxial layers as thick as 100µm are available for immediate purchase -
Thu Aug 23 14:51:00 CDT 2012 -- Laser diode researchers order Oxford Instruments ion beam depo tool
Optoelectronics researchers at the Ferdinand-Braun-Institut ordered an Optofab3000 for Laser Bar Facet Coating from Oxford Instruments Plasma Technology. -
Wed Aug 22 09:05:00 CDT 2012 -- Dynamic changes impacting advanced electronic materials industry
Learn about the changes in semiconductor manufacturing as well as related markets -- photovoltaics, displays, LEDs, etc -- at the 2012 Strategic Materials Conference (SMC), to be held on October 23-24 in San Jose, CA. SEMI reports. -
Mon Aug 20 14:02:00 CDT 2012 -- Samsung and LED maker OSRAM settle patent disputes globally
OSRAM AG and Samsung Electronics Co., Ltd. have reached an agreement to settle all patent suits between them worldwide. The parties have reached license agreements for their respective LED patent portfolios.
POST A COMMENT
Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.
EDITORS' PICKS
TOP BLOG POSTS
Intel Foundries MEMS for Fuel Cell Start-up Nectar
IFTLE 134 SEMI 3D European Summit – Is the Wide IO Driver Dead?
EUV source roadmaps: Physics vs Engineering
Intel details 22nm trigate SoC process at IEDM
IFTLE 128: RTI 3D ASIP Part 1; Lester the Lightbulb update
Questions and answers on FD-SOI
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
LIVE NEWS FEED
RECENT ARTICLES
SEMICONDUCTOR ARTICLES
PACKAGING ARTICLES
MEMS ARTICLES
LEDS ARTICLES
DISPLAY ARTICLES
VIDEOS
NEW PRODUCTS
|
3M announces QDEF; to bring 50% more color to LCD devices
May 21, 2013
3M announced today it is in the final stages of scale-up for its new 3M Quantum Dot Enhancement Film (QDEF). The new film allow...
|
|
COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
|
|
Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...
|
|
Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
|
TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...
|
Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
|
WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
|
450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
|
BUYERS GUIDE
BLOGS
IFTLE 147 IME Updates 2.5D; Qualcomm Updates 2.5 / 3DIC at ICEP
Mon May 13 10:16:00 CDT 2013
IFTLE 146 TSMC Apple Rumors; Gartner OSAT Mkt Numbers; Novati
Sat May 04 12:01:00 CDT 2013
IFTLE 145 GPU Roadmap, IEEE 3DIC back in SF; ConFab 2013 Pkging
Sun Apr 28 15:23:00 CDT 2013
IFTLE 144 Personnel Changes in Taiwan; Glass Usage in WLP
Sun Apr 21 10:29:00 CDT 2013
IFTLE 143 HMC status; Pkging Materials $$ now Exceed Wafer Fab Materials
Sat Apr 13 17:15:00 CDT 2013
Tackling Design for Yield Questions at DAC
Wed May 22 15:39:00 CDT 2013
Join The ConFab discussion
Tue Feb 26 11:27:00 CST 2013
Questions and answers on FD-SOI
Fri Jan 04 14:56:00 CST 2013
Present your ideas at The ConFab in 2013
Mon Nov 26 09:04:00 CST 2012
The ConFab 2013 countdown begins
Thu Aug 09 16:18:00 CDT 2012
Intel Foundries MEMS for Fuel Cell Start-up Nectar
Wed Jan 30 14:40:00 CST 2013
IBM surprises with 22nm details at IEDM
Wed Dec 12 04:00:00 CST 2012
Intel details 22nm trigate SoC process at IEDM
Tue Dec 11 12:23:00 CST 2012
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
Tue Oct 02 16:22:00 CDT 2012
The Elephant Has Left the Room – 450 mm is a Go!
Tue Jul 10 09:35:00 CDT 2012
SUBSCRIBE
LATEST ISSUE
05/01/2013
Volume 56, Issue 3
Article Archive for Solid State Technology.