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MEMS
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Editors Picks
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Lasers and Sources
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Photonics Business
Editors Picks 2012 P
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11/05/2012 -- US semiconductor industry employs nearly 250,000 workers
Hours away from the US presidential election, here's one last message about jobs and growth in the semiconductor sector. -
10/30/2012 -- After worst-ever 2012, FPD equipment to see a brighter 2013
This year is shaping up to be a historically lousy year for makers of flat-panel display (FPD) manufacturing equipment, but expectations are looking up that demand will catch up to supply in 2013 and balance the market, according to NPD DisplaySearch projections. -
10/23/2012 -- Wafer shipments back on track: Inside the numbers
Wafer demand is slowly turning back toward growth, and a closer look at the numbers from SEMI and Semico Research shows what's behind the trends -- and why they give purchasing managers headaches. -
11/08/2012 -- Advancing CNTs for next-gen chips
Researchers from IBM and Georgia Tech have disclosed significant progress in manipulating carbon nanotubes in transistors and interconnects, in ways compatible with traditional fabrication techniques, advancing toward using the materials for next-generation devices.
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EDITORS' PICKS
TOP BLOG POSTS
Intel Foundries MEMS for Fuel Cell Start-up Nectar
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3M announces QDEF; to bring 50% more color to LCD devices
May 21, 2013
3M announced today it is in the final stages of scale-up for its new 3M Quantum Dot Enhancement Film (QDEF). The new film allow...
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COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
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Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...
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Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
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TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
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WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
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BUYERS GUIDE
BLOGS
Tackling Design for Yield Questions at DAC
05/22/2013
Join The ConFab discussion
02/26/2013
Questions and answers on FD-SOI
01/04/2013
Present your ideas at The ConFab in 2013
11/26/2012
The ConFab 2013 countdown begins
08/09/2012
IBM surprises with 22nm details at IEDM
12/12/2012
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05/01/2013
Volume 56, Issue 3
Article Archive for Solid State Technology.