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July 13, 2011 -- Stefan Wurm, SEMATECH, discusses his presentation on EUV lithography's infrastructure (July 13, SEMICON West TechXPOT) in this video interview with Debra Vogler, senior technical editor.
He covers the last 2 years of development in EUV lithography mask tools, including how partnerships with industry evolve, and where the significant milestones fall.
The first EUV litho beta tools have been delivered, and now the motivation is increasing throughput and reducing defects. Resists are "almost there," he adds.
| Gap |
Suppliers Building Solution? | HVM Solution Funded? | Time to HVM Solution |
|---|---|---|---|
| Mask Blank Actinic Inspection |
Yes (1 supplier) | Funded by Japanese Consortium (EIDEC) | 2013 |
| Mask Defect Review |
Yes (1 supplier) | Funded by SEMATECH EMI Partnership | 2014 |
| Patterned Mask Inspection |
Yes (4 suppliers) | Supplier/customer funded | 2013-15 |
SEMATECH EMI initiative was successful in leading the industry to close the EUV mask infrastructure gaps:
- Commercial actinic blank inspection solution meeting memory manufacturer needs through EIDEC – will need to extended to meet all industry needs (memory, logic, and foundry)
- SEMATECH EMI partnership enables commercial tools through JDA with Carl Zeiss
- SEMATECH EMI effort galvanized supplier led tool development programs (AMAT, HMI, KLA-Tencor) and EIDEC funds tool development at EBARA.
