December 7, 2011 -- Process control supplier KLA-Tencor Corporation (NASDAQ: KLAC) added to its SensArray portfolio of advanced wireless temperature monitoring wafers. The products use time-based, in-situ temperature monitoring to register process-environment effects on production semiconductor wafers.
The additions were developed with the aid of leading IC makers and OEMs. The EtchTemp-SE (ET-SE), ScannerTemp and WetTemp-LP products help monitor temperature information across the entire wafer surface under real process conditions. SensArray thermal information can be used to optimize manufacturing equipment performance and uptime, qualify tools, perform root cause analysis of process excursions, and track manufacturing trends.
ET-SE delivers temperature wafer monitoring during silicon etch processes, providing temperature measurements with a higher signal-to-noise ratio than alternative methods. ET-SE assists in matching front-end-of-line etch chambers and qualifying electrostatic chucks.
ScannerTemp allows highly accurate temperature monitoring of dry and immersion lithography systems that have temperature-sensitive overlay performance. With a flat, standard-thickness wafer format, it offers a sensor-to-sensor range of 0.03°C in a 20-24°C operating range.
Designed for use with new wet clean systems used in IC manufacturing that require monitor wafers of standard thickness, WetTemp-LP can be used in single-wafer and batch-wet-clean environments. It uses multiple temperature sensors to gather spatial data.
KLA-Tencor also introduced BaseStation 300Z, a storage, charging, and data transfer system with smart front opening universal pod (FOUP) for EtchTemp (dielectric etch), EtchTemp-SE (silicon etch), ScannerTemp, and WetTemp-LP wafers.
KLA-Tencor Corporation provides process control and yield management products for semiconductor, data storage, LED, photovoltaic, and other related nanoelectronics industries. Additional information may be found at http://www.kla-tencor.com/.
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