December 2, 2011 -- Innolas Semiconductor GmbH, wafer sorting and laser marking system maker, received its first contract for a 450mm wafer handling system.
Innolas will further develop and fine-tune its Edge-Grip and next-generation handling technology to meet the needs of the 450mm semiconductor manufacturing application.
The system will be delivered in Spring 2012.
Visit the company at SEMICON Japan 2011 in Chiba: hall 4, booth 4C-801-13 at the German Pavillon.
More SEMICON Japan news:
- ULVAC CVD-Co, -Ni system suits 3D gate, MEMS fab
- Dainippon Screen single-wafer clean tool boasts 800 WPH
- Dainippon Screen develops maskless direct imaging exposure system
InnoLas Semiconductor develops and manufactures high-quality wafer laser marking and sorting equipment for the semiconductor industry. Learn more at http://www.innolas.com.
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