December 13, 2011 - PRWEB -- Mike Mayberry, VP and director of components research, Intel Corp. and Billy Dally, VP and chief scientist, NVIDIA will keynote the 15th Annual IEEE International Interconnect Technology Conference (IITC) and Exhibition, June 4-6 at the DoubleTree Hotel in San Jose, CA.
Mayberry will deliver "What Lies Ahead for Devices and Interconnects?" Mayberry oversees Intel's ongoing research on future process options. He joined Intel in 1984 as a process integration engineer and worked on development of EPROM, flash, and logic wafer fab processes; as well as roadmaps and test processes for Intel microprocessors; and now components research.
Dally's keynote, "Parallel Computing, High Bandwidth Networks and Interconnects," speaks to his work at Stanford University's computer science department developing system and network architectures as well as signaling, routing, and synchronization technology for parallel computing. Bill Dally was appointed chief scientist and VP of NVIDIA Research in 2009.
The keynotes will kick off a program focused on Materials and Unit Processes, Process Integration, Characterization, Reliability, Chip-Package Interaction (CPI), 3D Integration and TSV Technology, Novel Systems and Packaging, Novel Materials and Concepts, Back-End Memories and MEMS as well as Fine Grain 3D ICs, Contacts and Local Interconnects, Interconnects for Biological Applications, Networks-on-Chip, and Circuits for High-Speed and Low-Power Signaling.
Presentation abstracts being accepted through January 16, 2012. Submit an abstract for IITC here. http://www.his.com/~iitc/call.html
The IEEE IITC Conference and Exhibition attracts professionals from industry, academia, and national laboratories in semiconductor processing, interconnect design, and equipment development. Conference topics include both fundamental and applied research, as well as issues related to introduction into manufacturing. The U.S. venue is one of three locations for this premier technology conference, which rotates annually between the US, Europe, and Asia.
For further details about paper submissions, supplier seminar opportunities or other aspects of the conference, please contact iitc@his.com or visit http://www.his.com/~iitc/.
See John Iacoponi, IITC 2011 co-chair, reports on IITC 2011:
- Day 1: Keynotes, paper awards, low-k, chip/package interaction...
- Days 2, 3: Process integration, reliability, 3Di...
See Dr. Phil Garrou's blog from IITC 2011 here.
See blogger Michael A. Fury's postcards from 2010's IITC:
- Day 0: Short courses
- Day 1: 3D IC, barrier films...
- Day 2: Backend memory, MEMS, 3D/TSV...
- Day 3: Sub-30nm SoG gapfill, 22nm airgaps...
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