300mm wafers buck soft silicon growth trend

11/04/2011

November 4, 2011 -- Worldwide silicon wafer area shipments decreased 2% quarter-to-quarter in Q3 2011, and dropped 5% year-over-year, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

See Q2 2011 data here.

Total silicon wafer area shipments were 2,354 million square inches during the third quarter.
 
"Silicon shipments for the most recent quarter are reflecting the general hesitancy of the market,” said Dr. Volker Braetsch, chairman of SEMI SMG and corporate vice president, Siltronic AG. “While total silicon shipments have softened, 300mm diameter wafers actually shipped in record volumes.”

Also read: Flat silicon wafer shipments will pick up in 2012, 2013

Quarterly semiconductor silicon area shipments.* SOURCE: SEMI.

Millions of Square Inches (MSI)

 

Q3 2010

Q2 2011

Q3 2011

TOTAL

2,489

2,392

2,354

*Shipments are for semiconductor applications only and do not include solar applications

All data cited in this release is inclusive of polished silicon wafers, including virgin test wafers, epitaxial silicon wafers, and non-polished silicon wafers shipped by the wafer manufacturers to the end-users.

The Silicon Manufacturers Group acts as an independent special interest group within the SEMI structure and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi, etc.). The purpose of the group is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

SEMI is a global industry association serving the nano- and microelectronic manufacturing supply chains. For more information, visit www.semi.org.

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. 


VIDEOS

Electroiq 2 EIQ2

TECHNOLOGY PAPERS

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

Faster Time to Root Cause with Diagnosis-Driven Yield Analysis

This whitepaper describes the benefits of implementing a diagnosis-driven yield analysis flow using the Tessent® Diagnosis and Tessent YieldInsight® software...

WEBCASTS

Innovation in Semiconductor Manufacturing Instrumentation

As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...

3D and 2.5D Integration: A Status Report Live Event

This webcast will explore the present status of 2.5 and 3D integration, including TSV formation.

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012

The ConFab: Big data is here

Sun Jun 03 19:19:00 CDT 2012

Oh, snap!: Pics from The ConFab

Sun Jun 03 19:09:00 CDT 2012

SUBSCRIBE

LATEST ISSUE

Volume 56, Issue 1

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS