Steam + gas subsystem targets film uniformity, better wafer cleaning, and PV fab steps

RASIRC Steamer Turbo for semiconductor and photovoltaics fab lines.

October 13, 2011 - RASIRC debuted the Steamer Turbo for specialty applications in the semiconductor and photovoltaic industries, featuring integrated gas blending control.

Gas blending control increases steam + nitrogen or oxygen flow rates, resolving condensation issues by heating the compressed gasses above the steam dewpoint. The compressed gas control system delivers up to 100slm of gas at 120°C. The control system comprises a mass flow controller (MFC), regulator, filter, and in-line gas heater.

RASIRC finds that the gas blending technology can improve thermal oxide film uniformity and particle removal after condensation. The subsystem also suits new forms of semiconductor wafer cleaning, since the combination of ultra-high-purity steam and hot compressed gas provides a "sweep gas" that removes condensed steam from the wafer surface. Other applications include in-line oxidation and emitter drive-in for photovoltaics manufacturing.

"The Steamer Turbo integrates high flows of high-temperature nitrogen with 50slm of steam," said Jeffrey Spiegelman, RASIRC founder and president, reporting repeatability to ±1%.

RASIRC products generate ultra-high-purity (UHP) steam from de-ionized water to purify and deliver ultrapure liquids and gases. Visit www.rasirc.com.

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