By Debra Vogler, senior technical editor
March 31, 2011 -- Serial entrepreneur, Zvi Or-Bach, was interviewed by ElectroIQ about his latest startup, MonolithIC 3D. In this podcast interview, Or-Bach explains why the company changed its name (from NuPGA) when its mission changed. "The name change was in response to a strategic change we made once we discovered a path to monolithic 3D ICs," said Or-Bach. He noted that on-chip interconnects are the limiting aspect with respect to scaling, and that after making materials changes (i.e., Al to Cu, and SiO2 to low-k), the only solution is to go to 3D ICs.
Listen to Or-Bach's interview: Download (iPod/iPhone users) or Play Now
Figure. Next-generation monolithic 3D IC -- leveraging the gate-last process. SOURCE: MonolithIC 3DInterconnect delay → Monolithic 3D Implant H+ dummy gates Transfer on top of processed wafer and replace gates (<400°C) 90nm (2005) 45nm (2010) 22nm (2015) 12nm(2020) Transistor delay 1.6ps 0.8ps 0.4ps 0.2ps Delay of 1mm-long interconnect 5 x 102ps 2 x 103ps 1 x 104ps 6 x 104ps Ratio 3 x 102 3 x 103 4 x 104 3 x 105 3D
→
Semiconductor scaling costs
| Scaling down 0.7x | Scaling up (3D packaging) | |||||
| Cost: | Capital >$4B | Cost: | Capital: <$200M | |||
| R&D >$1B | R&D <$100M | |||||
| Benefits: | Die size 0.5x | Benefits: | Die size 0.5x | |||
| Power 0.5x | Power 0.5x | |||||
| Speed: | No change | Speed: | No change | |||
Table. The next-generation dilemma -- going up or going down? Companies can do both. SOURCE: MonolithIC 3D. | ||||||
3D IC technology
The technology being proposed by Or-Bach uses a combination of four ideas:
1) the gate-last process and proper sequencing of ion-cut (i.e., Smart Cut) technology;
2) low-temperature face-up layer transfer;
3) repeating layouts;
4) innovative alignment.
Or-Bach explains the process in detail (figure) in his audio interview. The technology still requires process development work, but looking ahead, Or-Bach views it as being applicable to both Tier 2 fabs that want to reinvent themselves and compete with leading-edge fabs, and leading-edge fabs that want to add value.
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