AMD analyst day takeaways: Closing the INTC gap with 2011 product roadmap, GloFo execution

11/15/2010

November 15, 2010 - Several analysts reporting from talks at AMD's analyst day in Sunnyvale, CA, came away with the company's for profitable growth and new products coming down the pipeline -- and if its leading-edge manufacturing partners can execute, the company could offer a new challenge to longtime rival Intel.

The company has a clear focus on profitable growth, eyeing 10%-15% unit growth for MPUs and GPUs in 2011 and 44%-48% gross margins (up from 40%-45%) and a better product mix and lower opex of 35% (vs. 37%), notes John Pitzer from Credit Suisse. Moving to wafer-based pricing (from 2Q) and transitioning away from SOI on 28nm should help those margin targets, adds Doug Freedman of Gleacher & Co.

Pitzer is bullish on the company's slated 1Q11 ramp of 40nm (via TSMC) single-chip processor + graphics "Brazos" platform for notebooks and netbooks, which he thinks could compete favorably with Intel's 32nm Sandybridge and give "modest upside" to its notebook share. AMD's 32nm "Llano" (made at GlobalFoundries) for midstream notebooks should start shipping in mid-2011 followed in 2012 by a 28nm version for netbooks/tablets. A 32nm "Bulldozer" chip (6-16 core variants) for servers is due in 2H11 (though a demo, according to Doug Freedman of Gleacher & Co., was "rather uninspiring"). Those offerings for notebooks/netbooks and servers "could result in AMD's most competitive MPU line-up in 3+ years," Pitzer notes.

Execution in fleshing out that lineup is critical, though, the analysts agree, particularly with GlobalFoundries and 32nm-28mm manufacturing. Freedman notes AMD management "quickly dispelled" rumors of 32nm yields slipping again and they instead pointed to "a healthy current ramp (1H11 volume shipments) to support a 2011 product cycle" and the 28nm version ready to sample in late 2011 and ramp volume by year's end. Nonetheless, he agrees that there needs to be visible "'meat-on-bones' execution and volume silicon before putting all doubts to rest."

AMD seems to have plateaued at 18%-19% share in computing, by far its biggest revenue slice (73%), and being one generation behind Intel in process node (now 45nm) and a "weak roadmap to compete vs. Intel's Atom into netbooks/tablets and Nehalem into servers" is unlikely to move the marketshare needle "until 2011 at the earliest," Pitzer suggests. Nevertheless, AMD does seem committed to closing that gap with Intel, notes FBR Research's Craig Berger. "While AMD's 32nm delays continue to disappoint investors, we do think AMD continues to make progress on closing the process node gap vs. Intel, and is improving its product offering with its Fusion products integrating better graphics functionality than what Intel will offer in Sandybridge," he writes.

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. 


VIDEOS

Electroiq 2 EIQ2

TECHNOLOGY PAPERS

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

Faster Time to Root Cause with Diagnosis-Driven Yield Analysis

This whitepaper describes the benefits of implementing a diagnosis-driven yield analysis flow using the Tessent® Diagnosis and Tessent YieldInsight® software...

WEBCASTS

Innovation in Semiconductor Manufacturing Instrumentation

As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...

3D and 2.5D Integration: A Status Report Live Event

This webcast will explore the present status of 2.5 and 3D integration, including TSV formation.

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012

The ConFab: Big data is here

Sun Jun 03 19:19:00 CDT 2012

Oh, snap!: Pics from The ConFab

Sun Jun 03 19:09:00 CDT 2012

SUBSCRIBE

LATEST ISSUE

Volume 56, Issue 1

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS