Soitec platform enables planar FD technology

The Soitec Group (Euronext Paris) released the Ultra-Thin Buried Oxide (UTBOX) extension to its Ultra-Thin (UT) silicon-on-insulator (SOI) platform, a robust substrate solution for chip designers tackling the performance, power and density challenges of mobile consumer devices.

Send this story to:

Enter the email address of the recipient.
Separate multiple addresses with commas.

Add your own personal message:

Enter your email address:

Note: Your email address is used only to let the recipient know who sent the story, and in case of transmission error. Both your address and the recipient's address will not be used for any other purpose.