For the sixth time, Solid State Technology, in cooperation with Advanced Packaging magazine, is inviting SEMICON West attendees to VOTE on products they see at the trade show, which takes place at San Francisco's Moscone Convention Center from July 15 to 17. There will be two separate competitions: one for the "Wafer Processing" products in Moscone's North, South, and Gateway halls, and one for the "Final Manufacturing" products to be located in Moscone's West hall.

Product descriptions for this year's Attendees' Choice Awards candidates read like a how-to guide for being a model of frugality. Whether it's improving yield, reducing emissions, achieving lower CoO, or smaller footprints  it's clear the mantra for the industry is doing more with less. Heeding the clarion call for modest consumption, one of the forums at SEMICON West will focus on ways to breathe life into old fabs by taking advantage of existing productivity opportunities in both 200mm and 300mm fabs. While many of the ACA-featured products will undoubtedly find their way into legacy fabs, many also address the more stringent requirements for advanced technology nodes and will be headed for product lines currently under development.

Aside from the obvious link between front-end and final manufacturing, i.e., 3D integration, suppliers at both ends of the spectrum are offering products that serve the emerging printed/flexible electronics and PV/solar sectors. And while bright lights of innovation still shine on front end manufacturing, it is interesting to note that this year, three-quarters of the products entered for ACA consideration are in the final manufacturing space.

A number of industry experts have alluded to the potential for 3D integration to enable a generational leap forward in performance and power with a modest capital investment. But 3D integration also has the power to keep the industry on its long-term productivity curve, achieving both high performance and functionality. Mobile electronics is a driver of the move to three dimensions and a key theme at SEMICON West this year as deposition and etch equipment suppliers step up to the challenges device manufacturers face when designing more compact consumer electronics. Equipment that supports 3D-IC technologies is also being featured for MEMS and packaging, further blurring the lines between front-end and final manufacturing.

Evidence of final manufacturing products treading deeper into the provenance of the wafer fab is the plethora of WLCSP, PoP, and TSV enabling solutions submitted for consideration for this year's ACA program. Along with 3-D integration schemes comes the challenge of using ultra-thin wafers; meeting that need are several clean and surface treatment products being unveiled at the show.

Wafer Processing

Photovoltaic panel scribing system
The SolarScribe automation series photovoltaic panel scribing system includes both mechanical and air-bearing versions of split-axis and gantry-style systems for maximum application flexibility. The system includes options such as multi-head scan axes, Z and theta correction axes, and machine base/isolation systems. The SolarScribe is coupled to company's Automation 3200 control system, which is totally digital and contains high-performance FireWire networked drives. Aerotech, Pittsburgh, PA USA; 412-963-7470, www.aerotech.com.

200/300mm cluster system
The Versalis fxP is a single-wafer 200/300mm cluster system that integrates multiple processes (including etch, PVD, and CVD) on one platform. Targeted for advanced research and development (R&D) activities for 3D-IC devices, Versalis fxP offers a route for customers to develop their Through Silicon Via (TSV) technology and easily migrate their processes for high-volume production. Using the Versalis fxP, users can link separate processes without breaking vacuum to discover potential performance benefits, and then apply those findings to optimally configure production systems. Aviza Technology Inc., Scotts Valley, CA USA; ph 831/439-6382, www.aviza.com.

Bridge modules
The BKK and BKR Bridge modules span long unsupported lengths and are fully enclosed to protect internal components from environmental contamination. The BKR belt-driven version is available in lengths up to 8,000mm, and the ball screw-driven BKK version offers higher thrust forces and lengths up to 5,500mm. Bridge Modules feature an extruded aluminum profile whose geometry has been optimized for extremely high torsional stiffness. Inside, two internal ball rail systems are mounted at a 90° angle to each other to maximize load and moment capacity. The Bridge Modules are suitable for applications where the module is not fully supported, such as the Y-axis in a gantry system. Bosch Rexroth, Hoffman Estates, IL USA; ph 847/645-3600; www.boschrexroth-us.com./

Equipment control software
CIMControlFramework is an equipment control software framework based on the latest Microsoft .NET technologies. It allows OEMs to meet the supervisory control, material handling, platform and process control, and factory automation requirements of the fabs. Equipment suppliers can leverage the framework features, configure or extend the framework, and integrate their own process control technology. CIMControlFramework is supported and maintained with upgrades, improvements, and performance enhancements. With a data-driven architecture at the core of the framework, data generated at any point on the tool can be quickly and easily accessed by any other module. Cimetrix Inc., Salt Lake City, UT USA; ph 801/256-6500, www.cimetrix.com.

Vacuum pump
The iXH harsh process vacuum pump meets the increased process pump demands at the 60nm and smaller semiconductor design nodes, while also reducing tool cost of ownership (CoO). It offers a smaller footprint than previous generations and features a modular design. It is optimized to handle hydrogen and other light gases and to better withstand the corrosive effects of ammonia. ALD processes, generally deposit <10% of the precursor on the wafer, dramatically increasing the potential for deposition in the pumps. The iXH addresses this with improved thermal control and increased torque. Larger exhaust stages and an inlet purge also make it suitable for extreme powder processes with TEOS flows above 5g/min. The iXH reduces tool CO2 emissions by up to 42%, with a reduced utility CoO of >10%, compared to previous-generation Edwards pumps. Edwards Vacuum, Crawley, West Sussex, UK; ph 44 (0) 8459 212223, www.edwardsvacuum.com.

20nm high-flow liquid filters
The Torrento family of high-flow liquid filters helps to improve liquid contamination control of nano-scale particles in wet etch and clean (WEC) manufacturing processes used in advanced semiconductor applications. Built on a combination of new membrane technology and an advanced ATE device construction, the Torrento filters provide high-yield, rapid bath cleanup cycles, and extended filter life, and allow for fast changeouts and increase cleanliness. Torrento filters also feature Entegris' industry-standard, non-de-wetting surface technology for use in a high-flow recirculated bath with aggressive aqueous chemistries. The capability to maintain flow rate at an extremely small pore size in outgassing chemistries such as SPM, SC1, and SC2, ensures the stable processing conditions needed for the high CpK results demanded at advanced technology nodes. The product is designed to help fabrication facilities improve yields while maintaining the lowest cost of ownership without sacrificing contamination control.
Entegris Inc., Chaska, MN USA; ph 952/556-3131, www.entegris.com.

Spray coating system
The EVG150 NanoSpray is a fully automated high topography spray coating system. The system uses a spray process based on a spray mist created by ultrasonic nozzles and supports wafers up to 300mm in diameter. The system is designed to conformally coat vertical via walls 300µm deep and 100µm in diameter. The system is also capable of deposition organic low-k materials. EV Group (EVG), St.Florian/Inn, Austria; ph 43 7712 5311 0, www.evgroup.com.

Thin-film analysis tool
The Auto SE thin-film analysis tool allows characterization of single and multi-layer thin films in one push of a button. Within a second, the Auto SE is said to provide accurate film thicknesses and optical constants over the Visible-NIR spectral range. The tool automatically adjusts the height of your sample, maps the entire surface of your wafer for uniformity check, and displays the results. With a spot size as small as 25µm × 60µm and its patented MyAutoView color vision system, the Auto SE is suited for device characterization and QC analysis. HORIBA Jobin Yvon Inc., Edison, NJ USA; ph 732/494-8660, www.autose.org.

Anti-backlash assembly
The VHD Series anti-backlash assembly provides the maximum load-carrying capability and the highest axial and radial stiffness of any Kerk nut assembly. The assembly provides low drag torque by making use of the company's Axial Take-up Mechanism, creating a stiff spacer that will continually expand to accommodate wear. The self-lubricating device combats vibration and noise challenges encountered in the semiconductor industry. Low friction and the elimination of recirculating balls provide smooth, uniform motion, according to company claims. VHD Series Screws are 303 stainless steel, with Kerk's custom Kerkote TFE extended life coating optional. Assemblies are available cut-to-length or with screws machined to your requirements. Kerk Motion Products, Hollis, NH USA; ph 603/465-7227, www.kerkmotion.com.

Centrifugal pump
The new BPS 600 Pump represents the latest thinking in proven magnetically levitated pump technology from Levitronix. The patented impeller floats in a magnetic field without touching anything but the fluid it is pumping. The BPS 600 is suitable for CMP Slurry Delivery because it eliminates shear stress and mechanical contact that cause particle agglomeration. The BPS 600, which 600 has a closed-loop electronic control, is also suitable for electroplating, because it has no bearings. The solution cannot plate out and clog the pump. The pump can sense pressure and flow at the tool and adjust itself automatically. Continuous flow with no pulsation ensures a high-quality wafer clean. The BPS 600 is the smallest size pump of its kind on the semiconductor market, according to company claims. Levitronix, Waltham, MA USA; ph 888/569 0718, www.levitronix.com.

Ultra-purification system
The PICO-TRAP Ultra-Purification System incorporates Matheson's Nanochem technology combined with a specialized purification chamber to deliver the most impurity-free semiconductor process gases available, according to company claims. PICO-TRAP technology has applications for many key process gases, which will enable end users to optimize process cycles and improve yields. This patented technology is designed within its own gas safety enclosure and is PLC-controlled for safe and reliable operation. In recent studies, PICO-TRAP demonstrated that Si-epitaxial operations were enhanced through purification of hydrogen chloride (HCl) etchant gas. The system removed volatile metal impurities and moisture content to levels not previously achieved. Moisture levels were measured down to 20 ppb, a tenfold reduction as compared to current purification systems. Matheson Tri-Gas Inc., Montgomeryville PA USA; ph 800/416-2505, www.matheson-trigas.com.

Differential Capacitance Manometers
The Type 226A and 228A Baratron Differential Capacitance Manometers provide differential pressure and vacuum readings from 1,000 to 0.2 Torr (133 to 0.027 kPa) at ambient temperature. The direct linear signals are accurate for very small pressure drops and flow rates, and the measurements are not sensitive to gas composition, eliminating any need for gas-specific correction factors, claims the company. The Inconel nickel alloy capacitance sensor is corrosion-resistant, permitting use in difficult chemical environments. The Baratron manometer operates on either ±15V DC or +24V DC input voltage, and offers four different analog output signals in either uni-directional or bi-directional calibrations. The Type 228A manometer features two user-configurable, independently adjusted, and UL-listed electromechanical trip relays that can be set for activation anywhere from 0 to 100% of the full-scale range. Applications include air and gas flow measurements for filters and analytical systems, downstream pressure control in thin film processing systems, and automated leak testing systems. MKS Instruments Inc., Andover, MA USA; ph 978/645-5500; www.mksinst.com.

Sputter deposition system
The Apollo incorporates many standard features of NEXX sputter systems -- high throughput, small footprint, the ability to handle all wafer sizes and types, even the thickest or thinnest wafers -- but the Apollo reportedly also offers higher power operation, longer target lifetimes, faster cycle times, and a faster robot. The Apollo has process flexibility, with production solutions for under bump metallization (UBM), redistribution layer (RDL), backside metal, integrated passives, 3D packaging, and LED. Benefits include rapid size conversion, reportedly in less than two hours, and low cost of ownership. NEXX Systems Inc., Billerica, MA USA; ph 978/932-2020, www.nexxsystems.com.

Filter vessel system
The Pall FlexBowl filter vessel system is a flexible, eco-friendly system that allows the wet chemical user to interchange disposable capsules and replaceable housings of varying sizes. The PFA housings accept most standard filter cartridges. The permanent manifold reduces the replacement cost of capsules. The universal manifold is available with either ¾ in. or 1in. inlet and outlet port sizes. The PFA manifold is available with either flare-style or Pillar fittings. The FlexBowl housing meets standard temperature and pressure claims of conventional three-piece PFA housings. Pall Corp., East Hills, NY, USA; ph 800 645 6532, www.pall.com.

Megasonics generator
The Model 9400 Megasonics generators control transducers that are attached to process modules for cleaning wafers and other substrates and for particle contamination control. The 9400 has up to four independent channels, each capable of synchronized or independent control of power, frequency, and phase from 400kHz to over 3MHz, for a total combined power of up to 2,000W. Enhanced data-logging capabilities of the 9400 include 1GB worth of storage for megasonic process variables such as frequency vs. time, power vs. time, compare and overlap runs, and input from an external acoustic probe. The unit includes an intelligent controller embedded in each amplifier and can be programmed from a PDA interface panel or external laptop connection. Real-time data logging is available for sophisticated trend analysis of transducer wear patterns. The generators are compatible with most competitive transducers and can be retrofitted in the semiconductor fab. PCT Systems Inc., Fremont, CA USA; ph 510-657-4412; www.pctsystems.com.

3D-TSV Surface Treatment
The PS 4008 ASYNTIS is said to provide an all-in-one solution for 3D-through silicon via (TSV) ultra-thin silicon manufacturing and surface treatment. After wafer thinning or dicing, brittle silicon wafers require chemical surface treatment to regain the original strength. Remote cold dry etching (RCDE) is an isotropic process based on a microwave plasma source that provides remotely fluor radicals in argon downstream to etch silicon. The process fits into the current thinning and dicing production process, including consumable compatibility for blade and laser dicing. The manual version suits R&D and pilot line level and processes all substrates up to 300mm framed wafers. RCDE reportedly improves die strength by 500%. Die bending is possible at 60µm thickness, and metal vias are exactly exposed between 0.5 and 15µm, as the chip design requires. The PS 4008 ASYNTIS is said to singulate ultra-thin wafers damage free without expensive lithography steps. PVA TePla, www.pvatepla.com.

Room ionization and ceiling emitter system
The Gemini-G3 CleanRoom Ceiling Ionization System, when integrated with the company's next-generation ionization software (G3PM), has added intelligence to monitor and preemptively adjust to the changing condition of the environment. The G3 self-corrects its emitter output to maintain optimized performance throughout the life of the product. The system features "Peak Reduction" Technology (Pulse Overlap), which enables the G3 to reduce the offset voltage. Other features include real-time metering, historic event logging, and dynamic graphing of all metered values capable of storing values for up to 1500 emitters. The G3PM software can be programmed to immediately notify an operator of critical fault conditions via e-mail of up to 10 possible error conditions. SIMCO, Hatfield, PA USA; ph 215/997-0590, www.simcoion.biz.

Encoder
The new TONiC super-compact encoder features a readhead (35mm × 13.5mm ×10mm L-W-H) for application flexibility and installation in micro-manufacturing systems for the semiconductor, lab, and medical fields. Tonic is available in both linear and rotary versions and offers speeds to a maximum of 10 m/s (3 m/s @ 0.1µm resolution), resolution to 5nm, and operating temperatures up to 70°C. Innovative optics with very high 'signal to noise' ratio, combined with dynamic signal processing, ensure ultra-low sub-divisional-error (SDE <±30 nm) and jitter. The unit reads a variety of linear and rotary scale types, including a new version of the company's gold scale featuring the auto-phase IN-TRAC optical reference mark, which provides a bi-directionally repeatable index over the entire speed and temperature range without increasing overall system width. Integral dual limits are also available enabling users to select end of travel position. Renishaw Inc., Hoffman Estates, IL USA; ph 847/286-9953; www.renishaw.com.

Sensors
WaferScan 300 measures shape and thickness of wafers up to 300mm. The system is has a modular design allowing it to support a variety of sensors for different applications, including the company's Optical Stylus Probe (OSP) and new IR WTS, as well as roughness measurement sensor. Measurement capabilities include thickness, TTV, LTV, shape, stress, roughness, film thickness, X/Y dimensional measurement, and can be configured for semi or fully automated operation. Tamar Technology, Newbury Park, CA USA; ph 805/480-3358; tamartechnology.com.

X-ray microanalysis system
The NORAN System 7 features a high-throughput pulse processor, spectral imaging capability and a sophisticated software suite. The unit automatically analyzes both the x-ray spectrum and images during data acquisition to obtain the correct identification of the material under analysis. The accompanying software uses advanced peak shape fitting algorithms to identify the elements in the sample while also enabling high-speed analysis and the production of high-quality spectra, claims the company. The system computes and displays known phases or compounds while data are still being collected. Direct-to-Phase software presents elemental data in maps and spectra. Once the acquisition and analysis are complete, a single button generates a sample report in several popular file formats. Thermo Fisher Scientific Inc., Waltham, MA USA; Ph 781/622-1000; www.thermo.com/microanalysis.

Transfer valve
Series 06 XL-VAT transfer valve is for large substrate production systems for flat panel display, solar, glass coating, and other applications. The valves feature modular design technology; adjustable gate sealing force (high/low pressure); a pneumatic control unit for communication via logic interface; and an o-ring sealed shaft-feedthrough actuator (optional bellows) with a pneumatic locking device. These valves can be operated up to 1 bar differential pressure on the gate in either direction and up to 1 million cycles until first service under unheated and clean conditions. The Series 06 XL-VAT transfer valve is available in aluminum in sizes ranging from 4" × 54" to 12" × 100". VAT, Woburn, MA USA; Ph 781/935-1446, www.vatvalve.com.

Final Manufacturing

Center probe test socket
Aries Electronics' high-frequency center probe test socket for devices up to 13mm sq. was developed for manual, high-speed testing of devices such as CSP, mBGA, DSP, LGA, SRAM, DRAM, and Flash, with pitches as low as 0.40mm. The socket's solderless, pressure-mount, compression spring probes reportedly allow for easy mounting and removed from the test board. Four-point crown ensures "scrub" on solder balls for reliable contact mating, and its raised tip probe works with LGAs, MLFs and other socket types. The socket's gold-over-nickel compression spring probe screws leave small witness marks on the bottom of the device solder balls and are located by two molded plastic alignment pins and secured with four stainless steel screws.
This socket is said to provide minimal signal loss for higher bandwidth capability via a signal path of 1.95mm. With an overall size of 30.48mm × 21.34mm × 11.18mm, the socket provides the maximum allowable space for board components and connectors. Aries Electronics, Bristol, PA, USA; ph 215/781-9956, www.arieselec.com.

Compression encapsulation system
The IDEALcompress compression encapsulation system features direct application of molding materials into mold cavities, thus eliminating the waste associated with transfer molding. In combination with tape-assist modules, the nonvalue-added process of mold cleaning can reportedly be eliminated. Three models of the IDEALcompress address the processes of liquid epoxy molding (LEM), silicone liquid molding (SLM), and granular powder epoxy molding (GPM). The ability to handle liquid encapsulants makes this system suitable for high brightness LEDs. For liquid molding applications, the machine accommodates two-part materials with an on-board servo driven mixing system. All models feature a compact footprint and fast and low-cost package conversion. The system architecture shares components from ASM's wire and die bonder platforms. A range of lead frames and substrates up to 150 × 300 mm can be accommodated with the ability to quickly change the light-weight mold chase. ASM Pacific Technologies, Singapore, ph 602/437-4760, www.asmpacific.com.

Scalable dispensing platforms
The Spectrum S-920N Series of scalable dispensing platforms was reportedly designed to meet current and future process requirements, to allow for system upgrade as user needs change. Rapid Response Heaters ramp quickly to set point and deliver uniform heat across the entire part surface, while Controlled Process Heat (CpH) can be added for increased automated heat control. CpH provides software-managed real-time temperature control with programmable flow controllers that regulate air flow through the heater to enable dynamic control of part temperature. Programmable fluid and valve pressure allow pressures to be set in the software recipe to eliminate errors associated with manual adjustments. The system's laser height sensing with range finding capability is non-contact and is said to be 5× faster than traditional mechanical height sensing.
The Spectrum S-920N features Asymtek's patented non-contact jetting technology for applications such as stacked-die underfill, chip scale package (CSP) underfill, and encapsulation of wire bonded packages. Patented Mass Flow Control (MFC) and Calibrated Process Jetting (CpJ) add automatic fluid weight measurement and adjustment. It can be configured with single or dual lanes, and one, two, or three heat stations depending on capacity, process control, and application requirements. Asymtek, a Nordson Company, Carlsbad, CA USA; ph 800/279-6835, www.asymtek.com.

Thermal processing equipment
The Pyramax 75A furnace from BTU International features 75 inches of heated length in six zones, 350ºC maximum temperature, flexible platform configuration, low power consumption, and a comprehensive menu of options. Developed for situations where footprint is an issue, or where higher volumes are not needed, The Pyramax 75A is said to provide thermal uniformity through BTU's exclusive closed-loop convection control for a combination of high yield and low running costs. The system features side-to-side recirculation for enhanced temperature uniformity and convection efficiency that reduces zone temperature set points. Like the other Pyramax ovens, the Pyramax 75A features Windows-based WINCON oven control software, parts-identification software, a range of options for flux management, advanced conveyor solutions, and smart tracking SMEMA optional bar-code reader. BTU International, North Billerica, MA USA; ph 978/667-4111, www.btu.com.

WLP photoresist remover
EKC's WLP Photoresist Removers are a tested and proven integrated solution for area array packaging requirements, whether stencil printed, plated, pillared, or C4 applied. EKC162 is said to remove and dissolve photoresist more quicky and at lower temperatures than typical removers without attacking polyimide or metal layers. It has been formulated to enhance the removal of resists cleanly and efficiently, with full dissolution, preventing redeposition, while minimizing damage to metal conductors, bumps, and RDL dielectrics. Dupont, Wilmington, DE USA; ph 302/999-4592, www.dupont.com.

Die bonder
The FINEPLACER Lambda precision bonder from FINETECH reportedly achieves +/-0.5 µm placement accuracy for bonding applications such as flip chip, laser bars, VCSELs, MEMS, sensors, RFID, flexible die attach, and more. This semi-automatic version provides automatic touchdown with force control, as well as a temperature/environment controlled bonding operation after manual alignment of die and substrate. Key features include process reproducibility, patented optics to align large die (up to 40 mm) and substrate without reducing the field of view, and up to 10 programmable camera alignment positions. Bonding processes for the FINEPLACER Lambda include eutectic soldering, Au/Sn soldering, thermo compression, thermoultrasonic bonding, and adhesive technologies. FINETECH, Berlin, Germany, and Tempe, AZ USA; ph 480/893-1630, www.finetechusa.com.

Dicing die-attach films
Designed to streamline die-attach for stacked die applications, Hysol QMI5100 and Hysol QMI5200 combine the properties and functions of die-attach film (DAF) and dicing tape into one product. The film is laminated to the backside of the wafer, the wafer is diced, then picked up and moved to die placement. The need for dispensing or curing equipment or process steps is reportedly eliminated, as paste dispensing is not required and curing takes place during the standard molding process. The materials leave no burrs after dicing, enable bondline thickness control, and eliminate bleed issues associated with die attach pastes. Hysol QMI5100 is 10µm thick and is commonly used on the DAX levels of the die stack. Approved for use on DA1 and/or DAX, Hysol QMI5200 is available in a thickness of 20µm. Henkel Electronics Group, Irvine, CA USA; ph 949/789-2500, www.us.henkel.com.

Wire bond monitoring system
Process integrated quality control (PiQC) is a comprehensive multi-dimensional monitoring of the bond quality that allows for monitoring feedback of bond formation and allows conclusions of substrate surface conditions. A transducer-integrated sensor provides the signal relevant for the calculation of the quality index in real time. Processing of the signals is carried out by hardware and software with the appropriate link to a Hesse & Knipps digital ultrasonic generator. Bond quality monitoring includes such factors as oscillation at the wedge tip, transducer current, resonance frequency, friction, and wire deformation. All recorded feedback signals are statistically evaluated with the PiQC method to reportedly provide comprehensive quality information to the manufacturing manager. Hesse & Knipps, Paderborn, Germany, ph 49(0)5251 1560-0, www.hesse-knipps.com.

Advanced placement system
The CX-1 advanced placement system is capable of placing SiP, MCM, and other mixed-technology applications. Built on the base of a standard SMT machine, glass linear encoders and special software periodically checks and calibrates for ultra-high accuracy. Only three systems are used to accomplish the same production levels as traditional assembly lines, according to company claims. The CX-1 addresses the industry challenge of increasing use of bare die and flip chip mixed with standard SMT placement. It comes standard with four placement heads capable of laser/vision centering, independent X and theta motors, and can handle boards up to 330 × 250 mm and features a standard 27mm FOV high-resolution camera. It is compatible with existing feeders and line control software (HLC). Juki Corp., Fremont, CA USA; ph 510/249-6700, www.jas-smt.com.

Aqueous cleaner
MX2628 is designed to clean lead-free flux materials from advanced packages while providing mirrored solder finishes. MICRONOX MX2628 is environmentally friendly, has a long tank life, and is safe for multiple pass applications. Because it runs at low concentrations and low temperatures, MX2628 is said to provide consistent results and low cost of ownership. The non-flammable, non-corrosive liquid cleaner is compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes and is a biodegradable low VOC aqueous solution. It contains no CFCs or HAPs. All ingredients are TSCA-listed. Kyzen Corp., Nashville, TN USA; ph 615/831-0888, www.kyzen.com.

Plasma cleaning and contamination removal system
The PE-100 is a low-cost plasma etching system for universities, small R&D laboratories and pilot production facilities. The PE-100 provides a vacuum chamber that accommodates up to 240" of process area capacity per run cycle. An RF power supply with matching network, vacuum pumping, PLC based process/vacuum controller with touch screen programming is included. Any process developed on the PE-100 can reportedly be scaled up to the larger Plasma Etch Inc systems as required by substrate size and throughput demands. All Plasma Etch Inc systems operate using a dry RF-induced ionized plasma process enabling uniform removal of contaminants such as organics, coatings, and metals, and provide a hydrophilic surface for adhesion of subsequent part processing. Processes are suited to MEM and wafer level packaging (WLP) as well as many other related. Plasma Etch Inc., Carson City, NV USA; Carson City, NV USA; ph 775/883-1336, www.plasmaetch.com.

High-performance sockets
H-Pin is a stamped contact with probe pin performance that is said to provide a robust contact solution for challenging environments. It was developed to serve applications requiring reliable electrical and mechanical interconnect at a program-enabling cost. The three-piece, self-retaining H-Pin technology provides a current-carrying capacity up to 6 amps and allows burn-in temperatures up to 200°C with electrical characteristics suited to higher-frequency devices, such as large package mP and ASICs. It offers compliancy up to 0.8mm of travel. Plastronics, Irving, TX USA; ph 972-258-2580, www.PlastronicsUSA.com.

Bump and probe mark inspection
The WS 3840 System, for inspection and metrology of bumped wafers and probe marks, is the newest member of the company's Wafer Scanner Series. The WS 3840 is a high-throughput system that provides 2D and 3D bump metrology inspection, such as height, coplanarity, length/width, diameter, true position; bump defect inspection, such as bridging, missing nodules, nodule/crater inspection on gold bumps; and probe mark inspection. The WS 3840 can also provide diced wafer inspection to help ensure the die is free of damage from the dicing process. All data is gathered and processed in real-time, with an optional color review station. Rudolph Technologies, Flanders, NJ USA; ph 973/691-1300, www.rudolphtech.com.

Test sockets
Synergetix WLCSP interposers are based on Endura three-piece spring contact probes. Interposers are designed to order for specific probe types, package designs, and site arrangements. Up to 16 sites may be simultaneously contacted. According to company claims, interposers may be repaired in a matter of minutes and provide easy board layout, since pads are directly under device leads. Endura plating allows them to be used for hundreds of thousands of cycles, even with lead-free bumps. Features include bandwidths >10GHz, current ratings as high as 7 amps per pin, and pitch as fine as 0.25mm. Interconnect Devices Inc., Kansas City, KS USA; ph 913/342-5544, www.synergetix.com.

Epoxy flux
Hysol FF6000 epoxy flux material combines flux functionality and underfill protection into a single material. A reflow curable material, Hysol FF6000 has been formulated to provide fluxing action for lead-free solder joint formation and, when cured, delivers underfill-like protection against mechanical stress. In conventional capillary underfill processes, once the device is mounted onto the printed circuit board (PCB) or other substrate, the assembly is reflowed and the device is then underfilled. Hysol FF6000 streamlines these steps and affords an in-line alternative that offers thorough device protection as well. When using the epoxy flux process, array package bottom side spheres are dipped into Hysol FF6000 prior to component placement. The device is placed onto the PCB and then travels through reflow. The material is suitable for many applications, but it is particularly effective for the requirements of emerging Package on Package (PoP) device configurations and/or very large BGAs and CSPs where traditional underfill processes may be problematic. Henkel Corp., Irvine, CA USA, ph 949-789-2500, www.henkelna.com.

Packaging applicator
DirEKt Coat uses a mass imaging platform to facilitate the coating of wafers with die attach materials down to 25 microns in thickness. Enabled by a DEK-engineered ultra flat pallet, a wafer shield for protection of the wafer, a Galaxy mass imaging system, and a specially designed squeegee, DirEKt Coat delivers a solution for all ultra-thin wafer-level coating processes, including die attach materials, epoxy and protective backside coatings. Because the process is hosted on a screen printing platform that allows parallel (as opposed to serial) processing, units per hour (UPH) rates are significantly higher than those achievable with conventional dispensing methods and material coverage and uniformity are more accurately controlled. Semiconductor packaging specialists may also use the Galaxy system to host a variety of other packaging applications, including wafer bumping, sphere placement, thermal interface material processing, and encapsulation. DEK International, San Jose, CA USA; ph 408/954-8582, www.dek.com.

3D package
Z-Sky 3D Packages are used to stack and interconnect multiple semiconductor die in a single package. With package height less than 1mm, and footprints barely larger than the die, current focus is on using Z-SkyTM 3D Packages for the assembly of 8 to 16 flash die in micro-SD, BGA, and custom substrates for removable memory cards, cell phones, portable music players, and solid-state drives. The packages use a thin dielectric coating to insulate the edge of silicon die, and conductive polymer conductors, which replace bond wires, that cascade down the edge surface of the offset tier of stacked die to interconnect them. Vertical Circuits Inc., Scotts Valley, CA USA; ph 831/438-3887 ext. 130, www.verticalcircuits.com.

C-V Measurement instrument
The Model 4200-CVU C-V Measurement instrument is a plug-in module for Keithley's 4200-SCS Semiconductor Characterization System. The Model 4200-CVU makes capacitance measurements from femto Farads (fF) to nano Farads (nF) at frequencies from 10kHz to 10MHz. It contains eight software libraries that provide a broad range of C-V test and analysis. They cover all the standard applications, including C-V, C-t, and C-f measurement and analysis for high- and low-k structures, MOSFETs, BJTs, diodes, flash memory, photovoltaic cells, III-V compound devices, and carbon nanotube (CNT) devices. The device can be used in semiconductor technology development and process development and reliability labs, materials, and device research labs and consortia, any lab needing a benchtop DC or pulse instrument, and in most semiconductor labs and for users needing multi-use/multi-instruments in a small form factor. Keithley Instruments Inc., Cleveland, OH USA, ph 440/248-0400, www.keithley.com.

Test socket
The patent-pending Dyno Test Socket uses a contact for testing lead-free QFNs and other peripheral devices on 0.5mm and above. The Dyno contact, which is self-cleaning, is a BeCu-shaped metal. This Endura-plated contact provides a slight wiping action on the device leads, which assists with overcoming contaminants and oxides on the lead. The Dyno socket has a resistance of 20 milliohms against a matte-tin device and 10 milliohms a gold surface. Bandwidth is >10GHz @ -1dB at 0.5mm pitch. Current carrying capacity is 5 amps. The Dyno socket provides cycle life in excess of 500,000. The compressed length is 2.92mm. Board side compliance is 0.15mm with a force of 100 grams. Device side compliance is 0.23mm with a force of 100 grams. Operating temperature is from -50°C to 150°C. Synergetix, Kansas City, KS USA; ph 913-342-5544, www.synergetix.com.

Shielded Test System
SUSS ProbeShield Technology creates a measurement environment free from EMI and RFI for device characterization and modeling, process development, wafer-level reliability, and failure analysis. ProbeShield Technology enhances your device and process development, reducing feedback times and design. SUSS MicroTec, Waterbury Center, VT USA; ph 802/244-5181, www.suss.com.

Pick and place handler
Photo: SEMICON_MultitestMT2168
The new MT2168 pick and place handler features up to 16 contact sites, index time of 0.38 sec, soak capacity more than 3.5 JEDEC trays, and temperature accuracy +/-1degC. In addition, it offers throughput to 20,000 uph, conversion for a wide package range within 10 minutes, loadboard-copatibility, and scalable configuration. Multitest Elektronische Systeme GmbH, Rosenheim, Germany; ph +49-(0)8031-406, www.multitest.com.