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Semiconductors 2007 P

  • 10/30/2007 -- Rexchip, Air Products ink gas supply deal
    October 30, 2007 - Air Products and its Taiwan subsidiary Air Products San Fu Co Ltd. have agreed to supply nitrogen and bulk gases for Taiwan DRAM producer Rexchip Semiconductor Corp., the Powerchip-Elpida memory JV. Financial details were not disclosed.
  • 10/30/2007 -- "In-the-trenches" roundup of ISMI
    People doing the actual day-to-day work in fabs gathered at last week's ISMI Manufacturing Symposium (Oct. 24-25, Austin, TX), addressing topics on yield improvement/productivity methodologies, ESH, and sustainability. Specific talks focus on how to fix litho "hot spots," cleaning wafer chucks without DI water or solvents, guidelines for detecting/preventing electrostatic discharge (ESD) events, and why process stability may be the deciding factor in the battle over 450mm wafers.
  • 10/24/2007 -- Spansion/Saifun, SMIC extend NOR flash pact
    October 24, 2007 - Spansion Inc. and Chinese foundry SMIC are partnering to delve further into NOR flash, in a deal that utilizes SMIC's 65nm foundry work for Spansion's MirrorBit technologies, and extend into "selected segments" of flash memory to sell 90nm and 65nm and beyond MirrorBit Quad products in China.
  • 10/23/2007 -- Samsung touts 30nm NAND flash using double-patterning
    October 23, 2007 - Samsung Electronics Co. Ltd. says it has developed 64Gb multilevel cell NAND flash memory chip using 30nm process technology, built using double-patterning lithography, with commercial chips ready in about a year.
  • 10/22/2007 -- Elpida, UMC team for copper low-k memories
    October 22, 2007 - Japan's Elpida Memory Inc. and Taiwan foundry UMC have agreed to jointly develop a copper low-k backend process for both advanced DRAM and phase-change random access memory (PRAM).
  • 10/22/2007 -- Sarnoff approved as DoD "trusted foundry"
    October 22, 2007 - Sarnoff Corp. says its silicon wafer foundry has been accredited as a "microelectronics trusted source" for the US Department of Defense and all other US government users, able to offer foundry services for military quality microelectronics applications.
  • 10/19/2007 -- Analyst: Double-digit IC unit growth marches on; ASPs now key
    October 19, 2007 - Strong shipments of memory devices and automotive-related analog ICs are the main reasons why IC unit shipments will grow by double digits in 2007 (10%), continuing an "unprecedented" streak of six straight solid years of growth, according to data from IC Insights Inc.
  • 10/18/2007 -- SEMI hands out awards to UT-Austin's Willson, IBM's Meyerson
    October 18, 2007 - At its annual award banquet, SEMI has named winners of two awards: UT-Austin's C. Grant Willson, for his work in chemically amplified resists; and IBM's Bernie Meyerson for a lifetime of technical innovation.
  • 10/18/2007 -- Slurry recycler nails down $53M in financing
    October 18, 2007 - SiC Processing AG has secured $53M in funding from Europe's zouk ventures and a quartet of investment firms, to fund international expansion of its used slurry recycling business.
  • 10/16/2007 -- IMEC tips early EUV results, readies for preproduction tool
    October 16, 2007 - IMEC has tipped initial results of alpha-demo work on extreme ultraviolet (EUV) lithography work which it says produced the first high-resolution images, and has agreed to push ahead with plans to add a "preproduction" tool from partner ASML in its 300mm facility in time for the 22nm node in 2010.

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