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LEDs
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Semiconductors
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Photovoltaics
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Packaging
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Displays
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Energy Storage
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MEMS
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Semicon West
Semiconductors 2007 P
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11/12/2007 -- Call for improved EDA tools at the Common Platform Tech Forum
Advanced technology design was a major topic at this year's Common Platform Tech Forum (Nov. 6, Santa Clara, CA). The good news/bad news is that there are no new major design concerns at 45nm, but the hurdles the industry faced at 65nm are even more challenging at 45nm, and EDA tools need to be improved to overcome them. -
11/08/2007 -- TEL first toolmaker in SEMATECH's 3D interconnect program
November 8, 2007 - Tokyo Electron Ltd. (TEL) has joined SEMATECH's 3D Interconnect Program, the first supplier in the group launched in 2005 to evolve traditional copper/low-k interconnect technology to 3D chip stacking, including through-¬silicon vias (TSV) as interconnects. -
11/08/2007 -- SEMI: Wafer shipments slowing, as expected
November 8, 2007 - Wafer shipments were down slightly in 3Q from the prior quarter, fulfilling expectations of slowing wafer demand that will result in 8% growth in 2007, slightly lower than previous expectations, according to data from SEMI's Silicon Manufacturers Group (SMG). -
11/06/2007 -- What's really behind the top foundries' 2008 capex cutbacks?
After forecasting good to "lackluster" 4Q sales forecasts, the top pure-play foundries (TSMC, UMC, SMIC, and Chartered) say they will reduce spending in 2008, (10%-25% declines or more). Their stated reasons -- improve productivity in current production, migrate more mature processes down to 90nm and 65nm, and get ASPs back up and improve profitability -- send a great message to the investor community. But the real reason could be a much bigger shift in the leading-edge foundry business model. -
11/05/2007 -- Analyst: Notebook demand to be still hot in '08
November 5, 2007 - Notebook unit sales are on track for a better-than-expected 40% growth this year, and that growth will more than likely keep going through 2008 -- which would be great news for several chipmakers, according to an industry analyst. -
11/05/2007 -- Tackling systematic/random variations while matching process chambers
Few fab management practices are more "in the trenches" than using mathematics and statistics to investigate and solve real-life problems. One such technique highlighted at the recent ISMI Symposium on Manufacturing Effectiveness was "multivariate analysis" -- specifically, comparing two ashing chambers that were supposed to be matched, but whose output showed differences. -
11/02/2007 -- Yale U. dedicates new nanodevice fab
November 2, 2007 - Yale U. has dedicated a new $8 million, 2600-sq.-ft cleanroom facility for its Center for Microelectronics Materials and Structures for fabricating micro- and nano-scale devices for engineering research. The Center serves over a dozen research groups, nearly 40 students in engineering, and an increasing number of collaborators. -
11/01/2007 -- Qimonda sampling DDR 5 graphics chips
November 1, 2007 - Qimonda AG says it has begun sending customers of what it calls the industry's first samples of 512Mb DDR5 graphics processors. -
10/31/2007 -- Samsung buys Israeli image sensor firm to boost nonmemory ops
October 31, 2007 - Samsung Electronics Co. reportedly has acquired TransChip Israel Ltd., an Israel-based CMOS image sensor firm, the first time in a decade the Korean company has acquired a foreign company. -
10/30/2007 -- NAND flash, MPUs, foundry trends "shake up" 3Q07 chip supplier ranks
October 30, 2007 - Demand for NAND flash memory, battles in the MPU space, and pains of big customers' change in strategies have shuffled the rankings of top chip suppliers in 3Q07, just as predicted, according to data from IC Insights.
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