Photovoltaics 2007 P

07/18/2007 -- SEZ: Single-wafer cleaning gaining favor in BEOL
Cleaning wafers for flip-chip applications represents a growing area for Zurich, Switzerland-based SEZ, says Kurt Lachenbucher, executive VP and CEO. Though it's a niche market, it is an increasingly important area (~20% growth regularly), he explained. At the 45nm and 32nm technology nodes, particle issues become so critical that single-wafer cleaning can improve semiconductor yields. Cleaning can damage the wafer surface; therefore, methods that prevent damage grow in importance.
07/17/2007 -- Brewer Science, EV Group debut bonding combo for ultrathin wafers
July 17, 2007 - A new system for ultrathin wafer processing developed by Brewer Science Inc. and EV Group aims to provide a temporary wafer bonding technology for reliably processing sub-100-micron thinned wafers.
07/16/2007 -- SEMI slashes three-year growth forecast
SEMI's new mid-year 2007 capital equipment revenue forecast, unveiled during its annual opening day press conference at SEMICON West 2007 in San Francisco, predicts sharply reduced growth projections for the next three years, compared to figures released in the association's year-end 2006 forecast.
07/16/2007 -- Intevac goes linear with entry into the dielectric etch market
July 16, 2007 - After a 15-year focus on magnetic disk media sputtering/coating technology, Varian spinoff Intevac Inc. has set its sights on the dielectric etch market (and the wasted space associated with cluster tool designs) with the launch of its new Lean Etch tool at SEMICON West. And the company doesn't plan to stop there.
07/16/2007 -- Tower lines up Fab2 expansion funds
July 16, 2007 - Israeli foundry Tower Semiconductor Ltd. says it has closed funding commitments totaling $100 million from lender banks and major shareholder Israel Corp., with which it is "exploring unique tool acquisition opportunities" that would boost capacity at its Fab 2 200mm site, primarily for 0.13-micron and below process technologies, "in a cost-effective manner."
07/16/2007 -- NY firm rolls out nanowire deposition tools
July 16, 2007 - First Nano, a division of CVD Equipment Corp., has unveiled two solid source deposition systems specifically for producing semiconducting nanowires, saying that solid sources such as gallium and zinc powders are less expensive and safer than conventional metal organic sources used in metal organic vapor deposition chemical vapor deposition (MOCVD) methods for manufacturing LEDs.
07/12/2007 -- Qimonda sampling 75nm ultralow-power mobile RAM
July 12, 2007 - Qimonda AG says it has started sampling ultralow-power 512Mbit DRAM devices for mobile applications, using a 75nm low-power trench technology, that consume just 20% of power as equivalent-density standard DRAMs. Target end-devices include smart/feature phones, portable GPS, digital cameras, and MP3 players.
07/11/2007 -- Vesta, SEMATECH's ATDF tout low-temp TiN films and "super high-k" films
July 11, 2007 - Vesta Technology Inc. and SEMATECH's Advanced Technology Development Facility (ATDF) say they are touting a pair of technology achievements: a nondamaging process that allows deposition of plasma-enhanced TiN films at 30% lower temperatures than conventional methods, and a "super high-k" offering nearly twice the dielectric constant than HfO2- and ZrO2-based films.
07/10/2007 -- July 2007 Exclusive Feature:
Being there: The key to serving fabs in Asia
By Phil LoPiccolo, Editor-in-Chief, Solid State Technology Given the enormous and rapidly growing consumer market in Asia, it comes as no surprise that chipmakers are expanding operations into these regions to satisfy the local demand for semiconductor devices at the lowest possible price points.
07/05/2007 -- SAFC repositions for semi market push
July 5, 2007 - Fresh off its recent acquisition of UK-based Epichem Ltd., a provider of high-purity chemicals, Sigma-Aldrich is turning its focus to the silicon and compound semiconductor markets, touting its beefed-up division's product roadmap at SEMICON West. Company execs talked with WaferNEWS about the company's direction, its focus on collaboration, and how to justify value in an increasingly consumer-oriented industry where lower prices mean tighter investment evaluations.

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