May 10, 2006 - Backend services provider United Test and Assembly Center Ltd. (UTAC) has signed a volume purchase agreement to adopt LTX Corp.'s X-Series Fusion CX test systems for its test facilities in Singapore, Taiwan, and China.
LTX engineers will provide support to UTAC in developing applications that provide the best test methodology and shortest test times.
UTAC previously selected LTX's CX RF test system for their Taiwan operations.
Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.
Intel Foundries MEMS for Fuel Cell Start-up Nectar
IFTLE 134 SEMI 3D European Summit – Is the Wide IO Driver Dead?
EUV source roadmaps: Physics vs Engineering
Intel details 22nm trigate SoC process at IEDM
IFTLE 128: RTI 3D ASIP Part 1; Lester the Lightbulb update
Questions and answers on FD-SOI
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
|
COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
|
|
Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...
|
|
Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
|
|
EV Group rolls out EVG120 processing system
May 7, 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...
|
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...
|
Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
|
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
|
450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
|
Article Archive for Solid State Technology.
Print
Email
Save
