February 4, 2005 - Kyocera Chemical Corp. is entering the automotive semiconductor materials business with an impact- and heat-resistant encapsulant for semiconductor chips mounted in automobiles. The company altered the molecular structure of the epoxy and phenol resins that are the primary components, adjusting the ratio of the resins used and adding nonflammable silica, according to the Nihon Keizai Shimbun.
The new material will be priced moderately higher than encapsulants for personal computers the company already sells. It will be produced at the company's plant in Fukushima Prefecture and supplied to autoparts manufacturers.
An increasing number of semiconductors are being used in automobiles for such tasks as engine control. By adding automotive products, Kyocera Chemical aims to increase encapsulant sales to 5 billion yen (US$47 million) in fiscal 2007.
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