IMEC, Axcelis form partnership for sub-45nm

02/15/2005

February 15, 2005 - Axcelis Technologies Inc. today announced that the company's new single wafer ion implantation technology platform has been purchased by IMEC, Europe's largest independent nanoelectronics research center, for use in its sub-45nm device development activities.

In addition to the sale, Axcelis has become a partner in IMEC's Industrial Affiliation Program (IIAP) for Planar devices, Ultra-shallow junctions, Silicides and Strain (PLUSS) to jointly develop advanced processes for device integration using Axcelis' new single wafer, low energy technology.

IMEC chose Axcelis' single wafer, low energy platform because it offers the ability to produce highly uniform implants across a broad range of energies, for mid-dose applications, including HALO processes. The system supports implant energies from 500eV all the way to 750keV.

As a member of the IIAP PLUSS, Axcelis joins other semiconductor companies in developing advanced processes for device integration. IMEC's industrial affiliation programs foster joint R&D focused on a specific topic or technology area between industrial researchers and IMEC research teams. The concept is recognized worldwide as one of the most successful international partnership models for joint development of next-generation technologies.

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. 

LIVE NEWS FEED

There is no current content available.


VIDEOS

Electroiq 2 EIQ2

TECHNOLOGY PAPERS

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

Faster Time to Root Cause with Diagnosis-Driven Yield Analysis

This whitepaper describes the benefits of implementing a diagnosis-driven yield analysis flow using the Tessent® Diagnosis and Tessent YieldInsight® software...

WEBCASTS

Innovation in Semiconductor Manufacturing Instrumentation

As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...

3D and 2.5D Integration: A Status Report Live Event

This webcast will explore the present status of 2.5 and 3D integration, including TSV formation.

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012

The ConFab: Big data is here

Sun Jun 03 19:19:00 CDT 2012

Oh, snap!: Pics from The ConFab

Sun Jun 03 19:09:00 CDT 2012

SUBSCRIBE

LATEST ISSUE

Volume 56, Issue 1

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS