Semiconductors 2001 P
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02/21/2001 -- Winbond sees 2000 as most profitable year
February 21, 2001--Taipei, Taiwan--Winbond Electronics Corp. recently announced that its annual revenue for 2000 was NT $49.158 billion, an increase of approximately 52% compared with NT $32.347 billion in 1999. Overall, the financial results for 2000 are the most profitable to-date in the company's 14-year history. -
02/21/2001 -- BOC Edwards Kachina to open semiconductor component cleaning facility in Oregon
February 21, 2001--BOC Edwards Kachina is nearing completion of a state-of-the-art semiconductor component cleaning facility in Hillsboro, OR. The 22,000-sq-ft facility will be the third full service BOC Edwards Kachina operation in the U.S., providing chipmakers with a range of cleaning processes, component management, and support services. The facility is scheduled to become operational in May. -
02/20/2001 -- Legerity opens IC design center in Canada
FEB. 20 Austin, Texas--Legerity today announced the opening of its new, advanced communication IC design center in Ottawa, Ontario. The center will focus on communication system design and validation and CMOS integrated circuit design and verification, which are key technologies for the company's global growth plans. -
02/16/2001 -- Micron to purchase DRAM fab
FEB. 16 Boise, Idaho--Micron Technology, Inc. has signed a $25 million (3 billion yen) acquisition agreement to purchase Kobe Steel Ltd.'s equity interest in KMT Semiconductor Ltd., a DRAM fab located in Nishiwaki City, Hyogo Prefecture, Japan. -
02/15/2001 -- Infineon introduces new type of low-power DRAM
February 15, 2001--Munich, Germany--Infineon Technologies AG recently introduced a new DRAM product line for the strongly growing market of handheld devices. The Mobile-RAM family combines three important features specifically needed in handheld battery-powered applications such as very low power consumption, small form factor, and low cost per bit. -
02/13/2001 -- GHZ Technology modernizes, expands wafer fab capability for wireless infrastructure
FEB. 13 Santa Clara, California--GHz Technology Inc., a supplier of power transistors for radio frequency (RF) and microwave applications, today announced it has modernized its wafer fab and added state-of-the-art assembly and test capabilities to its Santa Clara facility. -
02/12/2001 -- Micronic receives repeat pattern generator order
February 12, 2001--Taby, Sweden--Micronic Laser Systems AB recently received a repeat order for a LRS11000 multi-beam laser pattern generator for the production of advanced photomasks for color filters used in TFT-displays. -
02/12/2001 -- Brooks Automation ships 2,000th 300mm load port
February 12, 2001--Chelmsford, Massachusetts--Brooks Automation, Inc. today announced that it has shipped its 2,000th 300mm Load Port FIXLOAD to the Sez Group. The tool uses front opening unified pod (FOUP) technology, which is standard for 300mm wafer production. -
02/12/2001 -- Boin, TePla sign OEM agreement
February 12, 2001--Tomerdingen, Germany--Boin GmbH, a metrology software manufacturer for the semiconductor industry, has entered into an OEM agreement with TePla AG, a manufacturer of metrology tools and low pressure plasma systems. TePla will use Boin's WAFERMAP metrology software on its TWIN SC measurement tool to support the visualization and interpretation of measurement results. -
02/12/2001 -- New family of low-power SDRAMs designed by Micron
February 12, 2001--Boise, Idaho--Micron Technology, Inc. today introduced the first devices in its new BAT-RAM family of low-power synchronous DRAMS (SRAM). The company currently is sampling 2.5- and 3.3-V 2 Meg x 32 64Mb BAT-RAM devices, and plans to introduce next-generation devices this year.
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