Packaging 2001 P
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10/18/2001 -- Applied Materials expands presence in China
October 18, 2001 - Shanghai, China - Applied Materials Inc. marked the opening of the company's major new facility and technical training center in the Pudong Zhangjiang High-Tech Park, Shanghai. -
10/17/2001 -- LSI Logic licenses flip chip packaging technology to Advanced Interconnect Technologies
October 17, 2001 - Milpitas, CA - LSI Logic and Advanced Interconnect Technologies (AIT) announced a licensing agreement in which AIT will license LSI Logic's organic laminate flip chip FPBGA technology. AIT joins a growing number of companies licensing LSI Logic's flip chip technology, the companies said. -
10/11/2001 -- ASE launches volume production of wafer-level chip scale packages
October 11, 2001 - Santa Clara, CA - Advanced Semiconductor Engineering Inc., a semiconductor packaging and testing company, will launch volume production of wafer-level chip scale packages (CSP) this quarter, ramping up to 2.4 million chips/month. -
10/05/2001 -- SpeedFam-IPEC pays MEMC $1.8M in litigation settlement
October 5, 2001 - Chandler, AZ - SpeedFam-IPEC and MEMC Electronic Materials have settled all litigation between the parties. In connection with this settlement, SpeedFam-IPEC has agreed to pay MEMC $1.8 million -
10/02/2001 -- The Pentium 4: Will it save the industry?
It's impossible to be a dispassionate observer when attending the Intel Developer Forum. You're either a believer or a skeptic. Intel seems to be on a quest for the Holy Grail of computing: developing multiple right combinations that give people what they want. -
08/29/2001 -- Unitive supports production requirements for Amkor
August 29, 2001 - Research Triangle Park, NC - Unitive Inc. and Amkor Technology announced the qualification of Unitive's wafer bumping technology for use in Amkor's flip chip product family. -
08/27/2001 -- IBM builds miniature circuit
August 27, 2001 - Armonk, NY- IBM Corp. claims its scientists have built the smallest-ever computer logic circuit, a two-transistor component made from a single molecule of carbon. -
08/22/2001 -- Microsemi launches wireless LAN antenna switch technology
August 22, 2001 - Irvine, CA - Microsemi Corp. has released a complete line of silicon antenna switches to meet the demanding requirements of 802.11a and HiperLAN2 broadband wireless LAN applications. -
08/02/2001 -- Teradyne to acquire GenRad in $260M deal
August 2, 2001 - Teradyne Inc., Boston, MA, has signed of a definitive agreement to acquire GenRad Inc., Westford, MA, a leading manufacturer of automatic test equipment and related software. -
07/16/2001 -- Dainippon Screen introduces laser tool for PCBs
Dainippon Screen will start selling a laser plotter for printed circuit boards in August that will reduce running costs to 1/15 current levels.
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