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Photovoltaics
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Semiconductors
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Packaging
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MEMS
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Semicon West
Photovoltaics 2000 P
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12/04/2000 -- PRI Automation expands manufacturing capability in Asia
Billerica, Massachusetts--PRI Automation, Inc. has signed a strategic alliance agreement with Shinsung Engineering Co. Ltd., a South Korean manufacturer of semiconductor cleanroom equipment and other industrial systems. Under the terms of the deal, Shinsung will assemble PRI's automated storage and retrieval systems for customers in Asia. -
11/29/2000 -- IBM, Infineon, and UMC building chips with 0.13-micron technology
East Fishkill, New York--IBM, Infineon, and UMC recently announced that they have begun building chips with the most advanced 0.13-micron foundry process technology currently available. -
11/29/2000 -- 'Chip-on-chip' patent granted to IXYS
Santa Clara, California--IXYS Corp. has been awarded U.S. Patent No. 6,107,674 for its chip-on-chip technology, which the company says enables a new level of integration for smart power semiconductors. -
11/28/2000 -- Detecting materials defects with picometer accuracy
Upton, New York--Researchers at the U.S. Department of Energy's Brookhaven National Laboratory (BNL) have developed a technique to detect defects in materials with picometer (one trillionth of a meter) accuracy. This is the highest accuracy ever achieved in such measurements, akin to finding a speck of dust in an area as large as the U.S. -
11/28/2000 -- SEMI posts October book-to-bill ratio of 1.17
North American-based manufacturers of semiconductor equipment posted orders of more than $3 billion in October 2000, reports Semiconductor Equipment and Materials International (SEMI), with a book-to-bill ratio of 1.17. Worldwide bookings and shipments in October topped September 2000 figures. -
11/28/2000 -- Elpida plans 300mm fab in Japan
Tokyo, Japan--Elpida Memory, Inc. is planning to construct a 300mm wafer fab, its first, on the grounds of NEC Hiroshima, Ltd. Construction will begin in January 2001, with volume production of 256 Mb dynamic random access memory (DRAM) devices in a 0.13-micron process expected to begin during the first half of 2002. -
11/27/2000 -- TRW and NASA develop highest frequency chips reported
Pasadena, California--Indium phosphate (InP) chips developed jointly by TRW Inc. and the U.S. National Aeronautics and Space Administration's (NASA) Jet Propulsion Laboratory (JPL), boasting a frequency of 215 GHz, are believed to be the highest frequency ICs ever reported. The chips were developed to enable increased data rates, while shrinking the size and increasing the overall performance capabilities of next-generation satellite communications and remote sensing payloads. -
11/21/2000 -- New technique shows unprecedented accuracy in measuring materials defects
Upton, New York--Nov. 21, 2000--Researchers at the U.S. Department of Energy's Brookhaven National Laboratory (BNL) have developed a technique to detect defects in materials with picometer (one trillionth of a meter) accuracy. -
11/16/2000 -- TSMC's Fab 6 pilot line now processing 300mm wafers
Hsinchu, Taiwan--Nov. 16, 2000--Taiwan Semiconductor Manufacturing Co. (TSMC) has begun processing 300mm wafers on its Fab 6 pilot line. -
11/15/2000 -- Kulicke and Soffa to acquire Probe Technology
Willow Grove, Pennsylvania--Nov. 15, 2000--Kulicke and Soffa Industries Inc. (K&S), a supplier of semiconductor assembly equipment and materials, has signed a $65 million definitive agreement to acquire Santa Clara, California-based Probe Technology Corp., a privately held manufacturer of probe cards for the semiconductor industry.
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