The NSX-100 is a new addition to the NSX series of automated micro defect inspection systems for wafer and die. It is said to offer an improvement in inspection time of up to 100 percent compared with previous industry standards. With high resolution image capturing technology and enhanced illumination techniques and optics, inspection time in a typical 8-inch wafer application reportedly can be cut from 120 to 60 sec.
August Technology
Edina, Minn.
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