Departments
- Advanced Packaging Road Show
  - Behind the Scenes
    On a picture-perfect day in October, the Advanced Packaging roadshow crew took to the autobahn from Stuttgart, Germany to Hanau, to tour Umicore Electronic Materials.
- In the News
  - EV Group and Brewer Science Establish Ultra-thin Wafer Bonding Lab
    In response to a call for localized support and increased demand of 3D IC process development in Asia Pacific, EV Group (EVG) and Brewer Science, Inc. have set out to outfit an ultra-thin wafer bonding lab in Taiwan.
- Editorial board
  - Localized Cooling for Data Centers
    For the past 50 years, the thermal management industry has offered only heatsinks, fans, and thermal grease as methods for electronics thermal management.
- Editorial
  - Gone Fishing
    I really like fly fishing. I’ve always wanted a fishing rod of my own, not one left over from an older brother’s stock of cast-offs, but a number 6 Orvis with just the right balance and flexibility for my style of trout fishing.
Features
- Cover Story
  - Weathering the Storm Together
    What were the most significant technological advancements in our industry in 2008?
- Through-wafer Inspection for MEMS Devices — a Comparison
  Defect detection within MEMS devices is vital to ensure their operation, but many mechanical properties cannot be determined through electrical or functional test.
- Solder-free Connectors Using Buckled Pillars
  A novel use of stud bumping equipment has enabled the development of buckled pillar connectors for 3D assemblies that are put together with screws rather than solder.
- The Back-end Process
  - Comparing Package Bond Thermal Performance
    Thermal Simulation Cuts Cost.

Editors' Picks

LIVE NEWS FEED

FORM 8-K: LATTICE SEMICONDUCTOR FILES CURRENT REPORT

Advanced Packaging Recent Articles

imec, PVA Tepla demo 3D TSV void detection

Novati to use Ziptronix bonding tech for 3D assembly

Through-wafer Inspection for MEMS Devices — a Comparison

EV Group and Brewer Science Establish Ultra-thin Wafer Bonding Lab

Gone Fishing

Localized Cooling for Data Centers

Solder-free Connectors Using Buckled Pillars

Packaging Topics

3D Integration

Wafer Level Packaging

Materials

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Table of Contents

Departments

Advanced Packaging Road Show

In the News

Editorial board

Editorial

Features

Cover Story

The Back-end Process

Editors' Picks

Nanya implements 3D IC TSV technology for DDR3, future DDR4 devices

ASM Pacific Technology delivers 100 x 300mm leadframe packaging set up

3D TSV packages outgrow semiconductor industry by 10X

2012 ITRS update: Back-end packaging and MEMS

Roadmapping More than Moore: When the application matters

Contemporary semiconductor packaging experts open up on cost

TOP BLOG POSTS

LIVE NEWS FEED

FORM 8-K: LATTICE SEMICONDUCTOR FILES CURRENT REPORT

Advanced Packaging Recent Articles

imec, PVA Tepla demo 3D TSV void detection

Novati to use Ziptronix bonding tech for 3D assembly

Through-wafer Inspection for MEMS Devices — a Comparison

EV Group and Brewer Science Establish Ultra-thin Wafer Bonding Lab

Gone Fishing

Localized Cooling for Data Centers

Solder-free Connectors Using Buckled Pillars

Packaging Topics

SUBSCRIBE

Issue 1

Table of Contents

Departments

Advanced Packaging Road Show

In the News

Editorial board

Editorial

Features

Cover Story

The Back-end Process

Editors' Picks

TOP BLOG POSTS

LIVE NEWS FEED

Advanced Packaging Recent Articles

Packaging Topics

SUBSCRIBE