Departments
- Editorial
  - Getting to Know IMEC Better Through Video
    During SEMICON West, we arranged to interview as many technology leaders as possible through short video coverage — conversations really.
- Exhibitor Spotlight
  - SEMICON West 2008 in Review
    The line in the sand is slowly being washed away. At this year’s SEMICON West, it was hard to tell the difference between the front-end and back-end players.
- In the News
  - K&S To Acquire Orthodyne Electronics; Divest Wire Business Unit to Heraeus
    FORT WASHINGTON PA — In a strategic move to further capitalize on its strengths as an equipment manufacturer, Kulicke & Soffa Industries announced that the company will acquire the assets of Orthodyne Electronics Corp, while also divesting its wire business unit to W.C. Heraeus GmbH.
  - SEMICON Europa’s Advanced Packaging Conference Shifts Focus from TSV to WLP
    STUTTGART, GERMANY — Shifting away from focus on 3D IC and TSV processes, this year’s Advanced Packaging Conference, at SEMICON Europa, titled “Technologies, Manufacturing And Supply Chain”, will focus on more immediate issues facing the back-end sector of the semiconductor industries.
  - Advanced Packaging and Solid State Technology Applaud 2008 ACA Winners
- Advanced Packaging Awards 2008: Signs of Hope
  In a slowing economy, everyone looks for signs of hope for a strong future. Unfortunately at times like these, funding for R&D often takes a back seat to the basic needs of a company to conduct commerce and basically stay in business by doing the same things in the same way just to keep pace.
- Editorial board
  - Continued Growth in Semiconductor Outsourcing Services
    As we enter the second half of 2008, the sedate long-term growth pattern of the semiconductor industry continues.
Features
- Cover Story
  - Thin, Strong, Cheap
    Thin, strong chips are assembled in chip packages; not bonded wafers. Therefore, die singulation must be considered from the start. Remote cold dry etching technology allows for the manufacturing of strong silicon chips in terms of highest possible mechanical properties and bending capability.
- Join and Protect
  Without underfill materials, many of today’s advances in packaging technologies wouldn’s be possible. A novel material system called epoxy flux combines a flux component with an epoxy system that facilitates solder joint formation while adding devide protection for increased process efficiency.
- Cooling High-power Packages
  Power dissipation and small packages are creating heat fluxes that must be addressed at either the package or system level. Designers face such challenges as thermal management as a gating factor and integration of small dies in larger packages. Contact and spreading resistance are mitigating factors for design success.
- The Back-end Process
  - 3-D Laser Metrology: Supporting Micro-bump Technology
    Emerging micro-bump wafers present unique challenges for measurement and inspection.

Editors' Picks

LIVE NEWS FEED

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Advanced Packaging Recent Articles

imec, PVA Tepla demo 3D TSV void detection

Novati to use Ziptronix bonding tech for 3D assembly

Through-wafer Inspection for MEMS Devices — a Comparison

EV Group and Brewer Science Establish Ultra-thin Wafer Bonding Lab

Gone Fishing

Localized Cooling for Data Centers

Solder-free Connectors Using Buckled Pillars

Packaging Topics

3D Integration

Wafer Level Packaging

Materials

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Table of Contents

Departments

Editorial

Exhibitor Spotlight

In the News

Editorial board

Features

Cover Story

The Back-end Process

Editors' Picks

Nanya implements 3D IC TSV technology for DDR3, future DDR4 devices

ASM Pacific Technology delivers 100 x 300mm leadframe packaging set up

3D TSV packages outgrow semiconductor industry by 10X

2012 ITRS update: Back-end packaging and MEMS

Roadmapping More than Moore: When the application matters

Contemporary semiconductor packaging experts open up on cost

TOP BLOG POSTS

LIVE NEWS FEED

Advanced Packaging Recent Articles

imec, PVA Tepla demo 3D TSV void detection

Novati to use Ziptronix bonding tech for 3D assembly

Through-wafer Inspection for MEMS Devices — a Comparison

EV Group and Brewer Science Establish Ultra-thin Wafer Bonding Lab

Gone Fishing

Localized Cooling for Data Centers

Solder-free Connectors Using Buckled Pillars

Packaging Topics

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Issue 8

Table of Contents

Departments

Editorial

Exhibitor Spotlight

In the News

Editorial board

Features

Cover Story

The Back-end Process

Editors' Picks

TOP BLOG POSTS

LIVE NEWS FEED

Advanced Packaging Recent Articles

Packaging Topics

SUBSCRIBE