In one of the most beautiful areas imaginable in the Pacific Northwest amidst flowers and greenery, two companies do leading-edge research and development work that affects how electronics work.
ORLANDO, FL —Everything about the Freescale Technology Forum Americas conference, held June 16 & 17, at the JW Marriott and Ritz Carlton Conference Center in Orlando, provided the attendee an opportunity to interact with the Freescale community.
Riding on recent advances in nano-fabrication technology, thin-film thermoelectric coolers (TF-TEC) have been developed with active material as thin as 10-20 µm.
Demands to reduce the dimensions of even the most highly miniaturized semiconductor packages are placing pressure on IC vendors and packaging specialists to develop faster and more productive package-assembly processes.
Challenges of high-end FCSiP include routability with acceptable signal and power integrity, package thermo-mechanical behaviors, and long term reliability performance.
Following the path of electronics evolution, many technological concepts such as system-in-package (SiP), system-on-chip (SoC), and stacked chip packaging have drawn exploration roadmaps for higher system integration.
