Table of Contents

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  • Departments

    • Editorial

      • From the Road
        I love to sit in airports and imagine what people are like outside of travel. For instance, a fellow just walked by with fur-lined ear flaps on his camo hat and flip flops on his feet.

    • Advanced Packaging Road Show

      • To Infinity and Beyond
        When it comes to semiconductor and MEMS devices, it is well-known that the industry is experiencing certain limitations – whether they are related to functionality, reliability or cost.

    • In the News

    • New Products

    • Editorial board

      • UBM: Creating the Critical Interface
        A variety of bumping technologies are in use today. Electroplating is used for fine-pitch (<250 μm) solder bumping, while robotic ball placement is used for larger pitch, lower (<100) I/O applications.

  • Features

    • Cover Story

      • Flip Chip’s Midlife Crisis
        The negatives of lead-free solders have triggered a growing renaissance in tried-and-true flip chip technologies, as improved equipment and new applications boost twentieth-century approaches.
    • DRIE for MEMS devices
      A Cost-effective Solution
      As high-volume MEMS production applications become a reality, device manufacturers are requiring low cost-of-ownership (COO) through high-yield at the wafer level and high overall equipment uptime. Several industrialized proprietary solutions have been developed to reach best performances.

    • Inside 3D Packaging

    • The Back-end Process

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