Table of Contents

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  • Departments

    • Editorial

      • A Celebration of Packaging
        A packaging engineer living in this Information Age has an obligation to keep on top of everything that’s happening.

    • Advanced Packaging Road Show

      • From End to End
        In semiconductor manufacturing, there’s a lot of talk about ends. First, there’s the front-end and the back-end.

    • In the News

      • EMC3D Consortium Achieves Cost Goal for TSV
        SANTA CLARA, CA — Two years ago, the EMC3D Consortium, an open consortia of equipment and materials manufacturers, established itself and set out to develop a process flow and cost model for 3D integration.

    • Packaging Trends

    • New Products

      • Wafer Bonder for CMOS Image Sensors
        In response to market needs For 300mm process equipment capabilities to demonstrate 3D processes, SUSS MicroTec has introduced The XBC300.

    • Editorial board

  • Features

    • How 3D is Stacking Up
      While moving towards tomorrow’s high-performance 3D packages with through-silicon vias (TSV) has captured most of the attention in the industry, stacked packages and similar established approaches have many 3D advantages and are making substantial, if quieter, technical and market progress.
    • The Great Debate: Copper vs. Gold Ball Bonding
      The increased price of gold is making gold ball bonding, a mainstay process in package assembly, cost prohibitive.
    • Laminated Housing Technology
      Traditional socket manufacturing methods are limited in the ability to meet contact methods of the test socket market, especially those related to semiconductor packages.
    • Mastering Material Sets
      Simple Testing to Evaluate Ball Attach Fluxes.

    • The Back-end Process

      • Adhesion Enhancement for Improved MSL
        With the development of environmentally friendly ICs at reduced thickness, the manufacturing of thermally reliable products becomes more demanding.

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