Table of Contents
Solid State Technology
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Departments
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Editorial
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News
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Industry Voices
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Correct-by-construction Methodology Enables Consumer Electronics Designs
The Japanese market, with its focus on consumer electronics and telecommunications, has embraced chip/package co-design and optimization for wire-bonded and system-in-package (SiP) devices.
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Correct-by-construction Methodology Enables Consumer Electronics Designs
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Notable Developments
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The Occam Process: A Package-first Approach to Electronics Assembly
Tin-lead solder was pressed into service as means of making reliable permanent interconnections between electronic elements in the early years of the electronics industry.
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The Occam Process: A Package-first Approach to Electronics Assembly
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PVD Processing for Flip Chip
Advanced packaging processes use physical vapor deposition (PVD) for gold bumping, solder bumping, redistribution (RDL), and integrated passive components.
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New Products
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Editorial board
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Advanced Packaging Road Show
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Features
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Cover Story
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High-brightness Matrix LEDs
Light-emitting diode (LED)-based applications are growing, and cover a broad range of markets including automotive lighting applications such as indicators, spot utility, and headlamps; camera functions like display backlights and camera flashes; consumer products such as LCD display backlight and projection systems; architectural uses like accent lighting for buildings, and signs; and many others. LEDs are bright, efficient, and quick to react.
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High-brightness Matrix LEDs
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Integrating Thermal Management and Burn-in Operations
In the semiconductor industry challenges appear to be directly related to Moore’s Law. In reality the culprit is consumer demand for more functionality, faster speeds, and smaller features. Technically, the integrated circuit (IC) industry is progressing at a rate that’s unmatched by any other industry. Yet, moving forward, it faces technical hurdles that slow progress, and must create advanced solutions without increasing costs.
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Automatic Optical Inspection of IC Connections
Die and wire bonding are among the most important IC connection technologies in electronic production.
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The Back-end Process
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Molding Transforms to Meet Advanced Market Requirements
Integral to the packaging process for over three decades, epoxy molding compounds have undergone significant advancements due to revolutions in semiconductor package geometries, and legislative requirements surrounding lead-free and “green” material adoption.
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Molding Transforms to Meet Advanced Market Requirements
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Editors' Picks
TOP BLOG POSTS
Intel Foundries MEMS for Fuel Cell Start-up Nectar
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Questions and answers on FD-SOI
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LIVE NEWS FEED
Advanced Packaging Recent Articles
Packaging Topics
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NEW PRODUCTS
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COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
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Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...
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Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
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EV Group rolls out EVG120 processing system
May 7, 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...
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