Departments
- Editorial
  - Conspicuous Collaboration
    At SEMICON West this year, steps towards efficiency, collaboration, and relationship-building were evident everywhere.
- Advanced Packaging Road Show
  - All That Glitters
    Semiconductor Packaging Materials, Armonk, NY
- News
  - In the News
- Trade Show Floor
  - Back-end Processes Take Center Stage at SEMICON West
    Whether the topic of discussion was yield management, reducing cost of production and test, the next area of industry expansion, or where a company is realizing the greatest revenue, back-end assembly and test was the focus at SEMICON West 2007.
- Advanced Packaging Awards
  - The APAs: Honoring Industry Innovation
    In a ceremony on July 18, 2007, Advanced Packaging celebrated the 7th Annual APA awards.
- Editorial board
  - Plans Are Nothing; Planning Is Everything
    This well-worn axiom from a top military planner, General Dwight D. Eisenhower, describes the mindset necessary to survive and prevail in the melee of business.
Features
- Cover Story
  - Single Wafer Surface Conditioning
    The need for back-side metal adhesion and solder contact for ultra-thin, discrete, high-power semiconductor devices has increased significantly over the past several years.
- Wafer Coating Advancements for Packaging Applications
  Demand for continuous reductions in semiconductor package height are coming from several directions, most notably memory chip vendors seeking increased density to meet aggressive price-performance roadmaps.
- Solutions and Solvents for Removing Silicone: A Practical Guide
  Silicone adhesives are becoming more widely used in microelectronic hybrid assemblies due to their inherently low elastic modulus, which relieves stress between substrates with different coefficients of thermal expansion (CTE) during thermal cycling.
- The Back-end Process
  - Flux and Underfill Compatibility in a Lead-free Environment
    Since their introduction nearly 20 years ago, the benefits of integrating flip chips into modern devices have been well proven.

Editors' Picks

LIVE NEWS FEED

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Advanced Packaging Recent Articles

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Novati to use Ziptronix bonding tech for 3D assembly

Through-wafer Inspection for MEMS Devices — a Comparison

EV Group and Brewer Science Establish Ultra-thin Wafer Bonding Lab

Gone Fishing

Localized Cooling for Data Centers

Solder-free Connectors Using Buckled Pillars

Packaging Topics

3D Integration

Wafer Level Packaging

Materials

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Table of Contents

Departments

Editorial

Advanced Packaging Road Show

News

Trade Show Floor

Advanced Packaging Awards

Editorial board

Features

Cover Story

The Back-end Process

Editors' Picks

Nanya implements 3D IC TSV technology for DDR3, future DDR4 devices

ASM Pacific Technology delivers 100 x 300mm leadframe packaging set up

3D TSV packages outgrow semiconductor industry by 10X

2012 ITRS update: Back-end packaging and MEMS

Roadmapping More than Moore: When the application matters

Contemporary semiconductor packaging experts open up on cost

TOP BLOG POSTS

LIVE NEWS FEED

Advanced Packaging Recent Articles

imec, PVA Tepla demo 3D TSV void detection

Novati to use Ziptronix bonding tech for 3D assembly

Through-wafer Inspection for MEMS Devices — a Comparison

EV Group and Brewer Science Establish Ultra-thin Wafer Bonding Lab

Gone Fishing

Localized Cooling for Data Centers

Solder-free Connectors Using Buckled Pillars

Packaging Topics

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Issue 6

Table of Contents

Departments

Editorial

Advanced Packaging Road Show

News

Trade Show Floor

Advanced Packaging Awards

Editorial board

Features

Cover Story

The Back-end Process

Editors' Picks

TOP BLOG POSTS

LIVE NEWS FEED

Advanced Packaging Recent Articles

Packaging Topics

SUBSCRIBE